JPS5469066A - Method and apparatus for lead formation - Google Patents
Method and apparatus for lead formationInfo
- Publication number
- JPS5469066A JPS5469066A JP13572377A JP13572377A JPS5469066A JP S5469066 A JPS5469066 A JP S5469066A JP 13572377 A JP13572377 A JP 13572377A JP 13572377 A JP13572377 A JP 13572377A JP S5469066 A JPS5469066 A JP S5469066A
- Authority
- JP
- Japan
- Prior art keywords
- roller
- lead
- tool
- lowers
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000015572 biosynthetic process Effects 0.000 title abstract 2
- 238000004299 exfoliation Methods 0.000 abstract 2
- 238000007747 plating Methods 0.000 abstract 2
- 238000005452 bending Methods 0.000 abstract 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13572377A JPS5469066A (en) | 1977-11-14 | 1977-11-14 | Method and apparatus for lead formation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13572377A JPS5469066A (en) | 1977-11-14 | 1977-11-14 | Method and apparatus for lead formation |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5469066A true JPS5469066A (en) | 1979-06-02 |
JPS6110984B2 JPS6110984B2 (enrdf_load_stackoverflow) | 1986-04-01 |
Family
ID=15158365
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13572377A Granted JPS5469066A (en) | 1977-11-14 | 1977-11-14 | Method and apparatus for lead formation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5469066A (enrdf_load_stackoverflow) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56165348A (en) * | 1980-05-26 | 1981-12-18 | Hitachi Ltd | Manufacturing apparatus for semiconductor device |
JPS5840845U (ja) * | 1981-09-11 | 1983-03-17 | 有限会社ティ・アンド・ケイ・インターナショナル研究所 | 半導体成形品におけるリ−ド折曲装置 |
JPS6052090A (ja) * | 1984-07-23 | 1985-03-23 | 株式会社日立製作所 | リ−ド切断成形機構 |
-
1977
- 1977-11-14 JP JP13572377A patent/JPS5469066A/ja active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS56165348A (en) * | 1980-05-26 | 1981-12-18 | Hitachi Ltd | Manufacturing apparatus for semiconductor device |
JPS5840845U (ja) * | 1981-09-11 | 1983-03-17 | 有限会社ティ・アンド・ケイ・インターナショナル研究所 | 半導体成形品におけるリ−ド折曲装置 |
JPS6052090A (ja) * | 1984-07-23 | 1985-03-23 | 株式会社日立製作所 | リ−ド切断成形機構 |
Also Published As
Publication number | Publication date |
---|---|
JPS6110984B2 (enrdf_load_stackoverflow) | 1986-04-01 |
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