JPS5466348A - Forming method for metal film - Google Patents

Forming method for metal film

Info

Publication number
JPS5466348A
JPS5466348A JP13289877A JP13289877A JPS5466348A JP S5466348 A JPS5466348 A JP S5466348A JP 13289877 A JP13289877 A JP 13289877A JP 13289877 A JP13289877 A JP 13289877A JP S5466348 A JPS5466348 A JP S5466348A
Authority
JP
Japan
Prior art keywords
film
films
metal film
substrate
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13289877A
Other languages
Japanese (ja)
Other versions
JPS5822544B2 (en
Inventor
Takeshi Suzuki
Hironobu Hatakeyama
Takashi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP13289877A priority Critical patent/JPS5822544B2/en
Publication of JPS5466348A publication Critical patent/JPS5466348A/en
Publication of JPS5822544B2 publication Critical patent/JPS5822544B2/en
Expired legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Weting (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

PURPOSE: To form the second metal film between the two first metal film with good efficiency and accuracy by removing the portions of the second film which are on the first films and in contact with the same, by photoetching, formed on a substrate.
CONSTITUTION: Two first metal films 5, 5 are formed on substrate 3, leaving a predetermined space, and resist films 8, 8 are formed on the films. Next, second metal film 7a is formed on n-type layer 1 of substrate 3 including films 8, 8. The portion of film 7a which is on one of films 5 and in contact with the same is removed by etching using a photomechanical process with resist film 9. The portion of film 7a which is on the other film 5 and in contact with the same is removed, leaving gate electrode metal film 7, and resist films 8, 10 are removed. Thus, the second metal film of desired width and thickness can be formed accurately at the desired position.
COPYRIGHT: (C)1979,JPO&Japio
JP13289877A 1977-11-05 1977-11-05 Method of forming metal film Expired JPS5822544B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13289877A JPS5822544B2 (en) 1977-11-05 1977-11-05 Method of forming metal film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13289877A JPS5822544B2 (en) 1977-11-05 1977-11-05 Method of forming metal film

Publications (2)

Publication Number Publication Date
JPS5466348A true JPS5466348A (en) 1979-05-28
JPS5822544B2 JPS5822544B2 (en) 1983-05-10

Family

ID=15092117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13289877A Expired JPS5822544B2 (en) 1977-11-05 1977-11-05 Method of forming metal film

Country Status (1)

Country Link
JP (1) JPS5822544B2 (en)

Also Published As

Publication number Publication date
JPS5822544B2 (en) 1983-05-10

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