JPS5462782A - Package method of semiconductor device - Google Patents

Package method of semiconductor device

Info

Publication number
JPS5462782A
JPS5462782A JP13053377A JP13053377A JPS5462782A JP S5462782 A JPS5462782 A JP S5462782A JP 13053377 A JP13053377 A JP 13053377A JP 13053377 A JP13053377 A JP 13053377A JP S5462782 A JPS5462782 A JP S5462782A
Authority
JP
Japan
Prior art keywords
leads
small quantities
multiple kinds
semiconductor device
simply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13053377A
Other languages
Japanese (ja)
Other versions
JPS613096B2 (en
Inventor
Morihiro Kada
Akizo Minamide
Koichi Kawamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP13053377A priority Critical patent/JPS5462782A/en
Publication of JPS5462782A publication Critical patent/JPS5462782A/en
Publication of JPS613096B2 publication Critical patent/JPS613096B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To meet small quantities and multiple kinds by using packages of the same outside shape for various elements and leading out leads of a required number.
CONSTITUTION: Package bodies are made constant in length l0, width l1 and thickness l2 and are varied in the number and pitch of leads 2 according to elements. Then, manufacturers are able to effectively provide devices of small quantities and multiple kinds simply by increasing or decreasing the number of leads and users are able to readily change design simply by changing the wiring patterns.
COPYRIGHT: (C)1979,JPO&Japio
JP13053377A 1977-10-27 1977-10-27 Package method of semiconductor device Granted JPS5462782A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13053377A JPS5462782A (en) 1977-10-27 1977-10-27 Package method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13053377A JPS5462782A (en) 1977-10-27 1977-10-27 Package method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5462782A true JPS5462782A (en) 1979-05-21
JPS613096B2 JPS613096B2 (en) 1986-01-30

Family

ID=15036562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13053377A Granted JPS5462782A (en) 1977-10-27 1977-10-27 Package method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5462782A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182435U (en) * 1982-05-28 1983-12-05 セイコーエプソン株式会社 External terminal structure of semiconductor devices
JPS5914349U (en) * 1982-07-19 1984-01-28 パイオニア株式会社 Flat package IC
JPS6175136U (en) * 1984-10-23 1986-05-21

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5292476A (en) * 1976-01-30 1977-08-03 Texas Instruments Japan Integrated circuit package

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5292476A (en) * 1976-01-30 1977-08-03 Texas Instruments Japan Integrated circuit package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58182435U (en) * 1982-05-28 1983-12-05 セイコーエプソン株式会社 External terminal structure of semiconductor devices
JPS5914349U (en) * 1982-07-19 1984-01-28 パイオニア株式会社 Flat package IC
JPS6175136U (en) * 1984-10-23 1986-05-21
JPH034043Y2 (en) * 1984-10-23 1991-02-01

Also Published As

Publication number Publication date
JPS613096B2 (en) 1986-01-30

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