JPS5462782A - Package method of semiconductor device - Google Patents
Package method of semiconductor deviceInfo
- Publication number
- JPS5462782A JPS5462782A JP13053377A JP13053377A JPS5462782A JP S5462782 A JPS5462782 A JP S5462782A JP 13053377 A JP13053377 A JP 13053377A JP 13053377 A JP13053377 A JP 13053377A JP S5462782 A JPS5462782 A JP S5462782A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- small quantities
- multiple kinds
- semiconductor device
- simply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To meet small quantities and multiple kinds by using packages of the same outside shape for various elements and leading out leads of a required number.
CONSTITUTION: Package bodies are made constant in length l0, width l1 and thickness l2 and are varied in the number and pitch of leads 2 according to elements. Then, manufacturers are able to effectively provide devices of small quantities and multiple kinds simply by increasing or decreasing the number of leads and users are able to readily change design simply by changing the wiring patterns.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13053377A JPS5462782A (en) | 1977-10-27 | 1977-10-27 | Package method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13053377A JPS5462782A (en) | 1977-10-27 | 1977-10-27 | Package method of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5462782A true JPS5462782A (en) | 1979-05-21 |
JPS613096B2 JPS613096B2 (en) | 1986-01-30 |
Family
ID=15036562
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13053377A Granted JPS5462782A (en) | 1977-10-27 | 1977-10-27 | Package method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5462782A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58182435U (en) * | 1982-05-28 | 1983-12-05 | セイコーエプソン株式会社 | External terminal structure of semiconductor devices |
JPS5914349U (en) * | 1982-07-19 | 1984-01-28 | パイオニア株式会社 | Flat package IC |
JPS6175136U (en) * | 1984-10-23 | 1986-05-21 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5292476A (en) * | 1976-01-30 | 1977-08-03 | Texas Instruments Japan | Integrated circuit package |
-
1977
- 1977-10-27 JP JP13053377A patent/JPS5462782A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5292476A (en) * | 1976-01-30 | 1977-08-03 | Texas Instruments Japan | Integrated circuit package |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58182435U (en) * | 1982-05-28 | 1983-12-05 | セイコーエプソン株式会社 | External terminal structure of semiconductor devices |
JPS5914349U (en) * | 1982-07-19 | 1984-01-28 | パイオニア株式会社 | Flat package IC |
JPS6175136U (en) * | 1984-10-23 | 1986-05-21 | ||
JPH034043Y2 (en) * | 1984-10-23 | 1991-02-01 |
Also Published As
Publication number | Publication date |
---|---|
JPS613096B2 (en) | 1986-01-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
MY8600583A (en) | Semiconductor integrated circuit devices and a process for producing the same | |
JPS528785A (en) | Semiconductor device electrode structure | |
JPS5462782A (en) | Package method of semiconductor device | |
JPS5391680A (en) | Semiconductor device | |
JPS5394881A (en) | Integrated circuit device | |
JPS51135383A (en) | Semiconductor variable capacitance device | |
JPS52156559A (en) | Small electronic device packaging package | |
JPS53120383A (en) | Production of semiconductor device | |
JPS53128285A (en) | Semiconductor device and production of the same | |
JPS5324290A (en) | Semiconductor device | |
JPS5323572A (en) | Electornic apparatus | |
JPS5219968A (en) | Semiconductor ic manufacturig process | |
JPS5318962A (en) | Semiconductor package | |
JPS5345968A (en) | Semiconductor device | |
JPS5313874A (en) | Production of semiconductor device | |
JPS53139476A (en) | Manufacture of semiconductor device | |
JPS5315768A (en) | Production of semiconductor device | |
JPS52135689A (en) | Production of semiconductor device | |
JPS53147487A (en) | Semiconductor device | |
JPS5384693A (en) | Production of semiconductor device | |
JPS5418670A (en) | Manufacture of semiconductor device | |
JPS5367386A (en) | Semiconductor device | |
JPS52103963A (en) | Semiconductor device and its manufacturing method | |
JPS5361968A (en) | Production of semiconductor device | |
JPS5227622A (en) | Transmission gate |