JPS5457963A - Resin sealing metallic mold of semiconductor device - Google Patents
Resin sealing metallic mold of semiconductor deviceInfo
- Publication number
- JPS5457963A JPS5457963A JP12548877A JP12548877A JPS5457963A JP S5457963 A JPS5457963 A JP S5457963A JP 12548877 A JP12548877 A JP 12548877A JP 12548877 A JP12548877 A JP 12548877A JP S5457963 A JPS5457963 A JP S5457963A
- Authority
- JP
- Japan
- Prior art keywords
- protrusion
- resin
- mold
- metallic mold
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52125488A JPS5854498B2 (ja) | 1977-10-18 | 1977-10-18 | 半導体装置の樹脂封止用金型 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP52125488A JPS5854498B2 (ja) | 1977-10-18 | 1977-10-18 | 半導体装置の樹脂封止用金型 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5457963A true JPS5457963A (en) | 1979-05-10 |
JPS5854498B2 JPS5854498B2 (ja) | 1983-12-05 |
Family
ID=14911322
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52125488A Expired JPS5854498B2 (ja) | 1977-10-18 | 1977-10-18 | 半導体装置の樹脂封止用金型 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5854498B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4888307A (en) * | 1986-08-27 | 1989-12-19 | Sgs Microelettronica S.P.A. | Method for manufacturing plastic encapsulated semiconductor devices |
-
1977
- 1977-10-18 JP JP52125488A patent/JPS5854498B2/ja not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4888307A (en) * | 1986-08-27 | 1989-12-19 | Sgs Microelettronica S.P.A. | Method for manufacturing plastic encapsulated semiconductor devices |
Also Published As
Publication number | Publication date |
---|---|
JPS5854498B2 (ja) | 1983-12-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS55128835A (en) | Molding method and mold used therefor | |
JPS5457963A (en) | Resin sealing metallic mold of semiconductor device | |
JPS5522960A (en) | Method and apparatus for preparation of synthetic resin goods having inside bended edge part | |
JPS564241A (en) | Manufacture of semiconductor device | |
JPS55139534A (en) | Method of molding pad for disk brake | |
JPS5664458A (en) | Metallic body | |
JPS5692040A (en) | High-temperature compression molds for friction pad | |
JPS55139241A (en) | Resin molding machine of substrate | |
JPS5298472A (en) | Lead frame for resin molding | |
JPS551210A (en) | Fitting jig of mold to plate glass | |
JPS5522873A (en) | Manufacturing method of resin sealing semiconductor device | |
JPS5521126A (en) | Marking method in resin mold parts | |
JPS574132A (en) | Manufacture of semiconductor device | |
JPS5663415A (en) | Resin sealing molding method of semiconductor device | |
JPS5387173A (en) | Molding mold | |
JPS56136270A (en) | Casting device | |
JPS5526672A (en) | Lead frame for semiconductor element | |
JPS5287982A (en) | Resin molding method of semiconductor elements | |
JPS5541237A (en) | Feeder of goods to be processed in resin mold | |
JPS571738A (en) | Mold device for forming resin layer on surface of sash member | |
JPS54149468A (en) | Production of resin seal-type semiconductor device | |
JPS53104171A (en) | Mold for semiconductor device | |
JPS5242372A (en) | Process for production of semiconductor device | |
JPS53149765A (en) | Metal mold for semiconductor device | |
JPS5437008A (en) | Method of fncapsulation molding of articles by hot static pressing |