JPS5457963A - Resin sealing metallic mold of semiconductor device - Google Patents

Resin sealing metallic mold of semiconductor device

Info

Publication number
JPS5457963A
JPS5457963A JP12548877A JP12548877A JPS5457963A JP S5457963 A JPS5457963 A JP S5457963A JP 12548877 A JP12548877 A JP 12548877A JP 12548877 A JP12548877 A JP 12548877A JP S5457963 A JPS5457963 A JP S5457963A
Authority
JP
Japan
Prior art keywords
protrusion
resin
mold
metallic mold
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12548877A
Other languages
English (en)
Other versions
JPS5854498B2 (ja
Inventor
Makoto Shimanuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP52125488A priority Critical patent/JPS5854498B2/ja
Publication of JPS5457963A publication Critical patent/JPS5457963A/ja
Publication of JPS5854498B2 publication Critical patent/JPS5854498B2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP52125488A 1977-10-18 1977-10-18 半導体装置の樹脂封止用金型 Expired JPS5854498B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52125488A JPS5854498B2 (ja) 1977-10-18 1977-10-18 半導体装置の樹脂封止用金型

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52125488A JPS5854498B2 (ja) 1977-10-18 1977-10-18 半導体装置の樹脂封止用金型

Publications (2)

Publication Number Publication Date
JPS5457963A true JPS5457963A (en) 1979-05-10
JPS5854498B2 JPS5854498B2 (ja) 1983-12-05

Family

ID=14911322

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52125488A Expired JPS5854498B2 (ja) 1977-10-18 1977-10-18 半導体装置の樹脂封止用金型

Country Status (1)

Country Link
JP (1) JPS5854498B2 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888307A (en) * 1986-08-27 1989-12-19 Sgs Microelettronica S.P.A. Method for manufacturing plastic encapsulated semiconductor devices

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4888307A (en) * 1986-08-27 1989-12-19 Sgs Microelettronica S.P.A. Method for manufacturing plastic encapsulated semiconductor devices

Also Published As

Publication number Publication date
JPS5854498B2 (ja) 1983-12-05

Similar Documents

Publication Publication Date Title
JPS55128835A (en) Molding method and mold used therefor
JPS5457963A (en) Resin sealing metallic mold of semiconductor device
JPS5522960A (en) Method and apparatus for preparation of synthetic resin goods having inside bended edge part
JPS564241A (en) Manufacture of semiconductor device
JPS55139534A (en) Method of molding pad for disk brake
JPS5664458A (en) Metallic body
JPS5692040A (en) High-temperature compression molds for friction pad
JPS55139241A (en) Resin molding machine of substrate
JPS5298472A (en) Lead frame for resin molding
JPS551210A (en) Fitting jig of mold to plate glass
JPS5522873A (en) Manufacturing method of resin sealing semiconductor device
JPS5521126A (en) Marking method in resin mold parts
JPS574132A (en) Manufacture of semiconductor device
JPS5663415A (en) Resin sealing molding method of semiconductor device
JPS5387173A (en) Molding mold
JPS56136270A (en) Casting device
JPS5526672A (en) Lead frame for semiconductor element
JPS5287982A (en) Resin molding method of semiconductor elements
JPS5541237A (en) Feeder of goods to be processed in resin mold
JPS571738A (en) Mold device for forming resin layer on surface of sash member
JPS54149468A (en) Production of resin seal-type semiconductor device
JPS53104171A (en) Mold for semiconductor device
JPS5242372A (en) Process for production of semiconductor device
JPS53149765A (en) Metal mold for semiconductor device
JPS5437008A (en) Method of fncapsulation molding of articles by hot static pressing