JPS5444471A - Print method of thick film - Google Patents

Print method of thick film

Info

Publication number
JPS5444471A
JPS5444471A JP11084277A JP11084277A JPS5444471A JP S5444471 A JPS5444471 A JP S5444471A JP 11084277 A JP11084277 A JP 11084277A JP 11084277 A JP11084277 A JP 11084277A JP S5444471 A JPS5444471 A JP S5444471A
Authority
JP
Japan
Prior art keywords
mask
film thickness
electrode
sensitive resin
photo sensitive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11084277A
Other languages
Japanese (ja)
Inventor
Kazuo Fushimi
Naotaka Yamakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11084277A priority Critical patent/JPS5444471A/en
Publication of JPS5444471A publication Critical patent/JPS5444471A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Gas-Filled Discharge Tubes (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE: To partially make thick the film thickness of electrode with a single mask, by partially making thick the film thickness of photo sensitive resin layer coating on the mask, in forming the discharge electrode of plasma display panel with screen printing.
CONSTITUTION: The mask 1 is constituted with the stainless wires in mesh shape and is stretched on the external frame W, and photo sensitive resin S is coated on the part other than PE and ET and no paste is transmitted. This mask is placed on the glass substrate G, the conductive paste is transmitted on the part of openings PE and ET with the pressure of squeezer, forming the electrodes on the substrate surface. Since the electrode terminal ET is soldered with the leads at a high temperature, it is required to make thicker than other for the electrode film thickness for the part. At the region A, the photo sensitive resin layer thickness tA is formed thicker than the layer thickess ts of other parts, for example, the part S, the clearance of the substrate and the mask mesh is greater at the electrode terminal forming scheduled position AET, and the amount of the conductive paste pushed out at the part is made greater, enabling to make thick the film thickness.
COPYRIGHT: (C)1979,JPO&Japio
JP11084277A 1977-09-14 1977-09-14 Print method of thick film Pending JPS5444471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11084277A JPS5444471A (en) 1977-09-14 1977-09-14 Print method of thick film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11084277A JPS5444471A (en) 1977-09-14 1977-09-14 Print method of thick film

Publications (1)

Publication Number Publication Date
JPS5444471A true JPS5444471A (en) 1979-04-07

Family

ID=14546036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11084277A Pending JPS5444471A (en) 1977-09-14 1977-09-14 Print method of thick film

Country Status (1)

Country Link
JP (1) JPS5444471A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817362U (en) * 1971-07-12 1973-02-27

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817362U (en) * 1971-07-12 1973-02-27

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