JPS5440570A - Method of bonding high voltage aluminum ball - Google Patents

Method of bonding high voltage aluminum ball

Info

Publication number
JPS5440570A
JPS5440570A JP9057278A JP9057278A JPS5440570A JP S5440570 A JPS5440570 A JP S5440570A JP 9057278 A JP9057278 A JP 9057278A JP 9057278 A JP9057278 A JP 9057278A JP S5440570 A JPS5440570 A JP S5440570A
Authority
JP
Japan
Prior art keywords
ball
high voltage
bonding
aluminum ball
voltage aluminum
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9057278A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6126221B2 (ref
Inventor
Ashiyurei Edoson Donarudo
Ian Jiyonson Keisu
Haabuei Sukotsuto Maikeru
Daburiyu Kaataa Arubaato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Welding Institute England
Original Assignee
Welding Institute England
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Welding Institute England filed Critical Welding Institute England
Publication of JPS5440570A publication Critical patent/JPS5440570A/ja
Publication of JPS6126221B2 publication Critical patent/JPS6126221B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
    • B23K20/004—Wire welding
    • B23K20/005—Capillary welding
    • B23K20/007—Ball bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/14—Preventing or minimising gas access, or using protective gases or vacuum during welding
    • H10W72/01551—
    • H10W72/07141—
    • H10W72/07168—
    • H10W72/07502—
    • H10W72/07511—
    • H10W72/07532—
    • H10W72/07533—
    • H10W72/07541—
    • H10W72/5522—
    • H10W72/5524—

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Wire Bonding (AREA)
  • Arc Welding In General (AREA)
JP9057278A 1977-07-26 1978-07-26 Method of bonding high voltage aluminum ball Granted JPS5440570A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB31346/77A GB1600021A (en) 1977-07-26 1977-07-26 Electrical inter-connection method and apparatus

Publications (2)

Publication Number Publication Date
JPS5440570A true JPS5440570A (en) 1979-03-30
JPS6126221B2 JPS6126221B2 (ref) 1986-06-19

Family

ID=10321761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9057278A Granted JPS5440570A (en) 1977-07-26 1978-07-26 Method of bonding high voltage aluminum ball

Country Status (6)

Country Link
US (1) US4323759A (ref)
JP (1) JPS5440570A (ref)
DE (1) DE2832050A1 (ref)
FR (1) FR2401522B1 (ref)
GB (1) GB1600021A (ref)
NL (1) NL184201C (ref)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169918A (ja) * 1982-03-31 1983-10-06 Hitachi Ltd ワイヤボンダ
JPS58212145A (ja) * 1982-06-03 1983-12-09 Toshiba Corp ワイヤボンデイング方法
JPS5917254A (ja) * 1982-07-20 1984-01-28 Shinkawa Ltd ワイヤボンダにおけるボ−ル形成方法
JPS5987829A (ja) * 1982-10-08 1984-05-21 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン ボンデイングボ−ル形成用の被覆ガス制御
JPS59139637A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd ワイヤボンダ
JPS60213038A (ja) * 1984-04-09 1985-10-25 Toshiba Corp ワイヤボンデイング装置
JPH01280330A (ja) * 1989-03-31 1989-11-10 Hitachi Ltd 半導体装置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4459452A (en) * 1980-06-30 1984-07-10 The Welding Institute Ball bonding of wire
NL8005922A (nl) * 1980-10-29 1982-05-17 Philips Nv Werkwijze voor het vormen van een draadverbinding.
US4388512A (en) * 1981-03-09 1983-06-14 Raytheon Company Aluminum wire ball bonding apparatus and method
US4390771A (en) * 1981-05-11 1983-06-28 Fairchild Camera & Instrument Corp. Bonding wire ball forming method and apparatus
US4387283A (en) * 1981-08-03 1983-06-07 Texas Instruments Incorporated Apparatus and method of forming aluminum balls for ball bonding
US4434347A (en) 1981-08-19 1984-02-28 Fairchild Camera And Instrument Corporation Lead frame wire bonding by preheating
US4549059A (en) * 1982-11-24 1985-10-22 Nec Corporation Wire bonder with controlled atmosphere
US4594493A (en) * 1983-07-25 1986-06-10 Fairchild Camera & Instrument Corp. Method and apparatus for forming ball bonds
US4482794A (en) * 1983-11-28 1984-11-13 Fairchild Camera & Instrument Corporation Pulse-width control of bonding ball formation
US4603802A (en) * 1984-02-27 1986-08-05 Fairchild Camera & Instrument Corporation Variation and control of bond force
US4597519A (en) * 1984-02-27 1986-07-01 Fairchild Camera & Instrument Corporation Lead wire bonding with increased bonding surface area
JPS60227432A (ja) * 1984-04-26 1985-11-12 Nec Corp ボンデイング用ワイヤのボ−ル形成装置
US4523071A (en) * 1984-05-14 1985-06-11 Hughes Aircraft Company Method and apparatus for forming a ball at the end of a wire
GB2165178A (en) * 1984-10-05 1986-04-09 Hitachi Ltd Method and apparatus for wire bonding
US4705204A (en) * 1985-03-01 1987-11-10 Mitsubishi Denki Kabushiki Kaisha Method of ball forming for wire bonding
JPH0640945B2 (ja) * 1987-12-10 1994-06-01 株式会社荏原製作所 放射線照射排ガス処理法
US6001724A (en) * 1996-01-29 1999-12-14 Micron Technology, Inc. Method for forming bumps on a semiconductor die using applied voltage pulses to an aluminum wire
DE29608277U1 (de) * 1996-04-30 1996-09-19 F&K Delvotec Bondtechnik GmbH, 85521 Ottobrunn Vorrichtung zum Ball-Bonden
EP1158578B1 (en) * 1996-10-01 2004-06-30 Matsushita Electric Industrial Co., Ltd. Integrated circuit or circuit board with bump electrode and manufacturing method thereof
US6234376B1 (en) * 1999-07-13 2001-05-22 Kulicke & Soffa Investments, Inc. Supplying a cover gas for wire ball bonding

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2759088A (en) * 1951-07-07 1956-08-14 Baker & Co Inc Method of rounding wire end
US2679570A (en) * 1951-08-18 1954-05-25 Bell Telephone Labor Inc Formation of electrode tip by electric current heating
NL7406783A (nl) * 1974-05-21 1975-11-25 Philips Nv Werkwijze voor het aanbrengen van een draad- verbinding aan een halfgeleiderinrichting.
US3934108A (en) * 1974-09-16 1976-01-20 Uthe Technology, Inc. Lead bonding method and apparatus
DE2517017A1 (de) * 1975-04-17 1976-10-28 Transistor Ag Verfahren zum anschmelzen von kontaktkuegelchen an anschlussdraehten insbesondere fuer halbleitervorrichtungen
GB1536872A (en) * 1975-05-15 1978-12-20 Welding Inst Electrical inter-connection method and apparatus
GB1468974A (en) * 1975-05-23 1977-03-30 Ferranti Ltd Manufacture of semiconductor devices

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169918A (ja) * 1982-03-31 1983-10-06 Hitachi Ltd ワイヤボンダ
JPS58212145A (ja) * 1982-06-03 1983-12-09 Toshiba Corp ワイヤボンデイング方法
JPS5917254A (ja) * 1982-07-20 1984-01-28 Shinkawa Ltd ワイヤボンダにおけるボ−ル形成方法
JPS5987829A (ja) * 1982-10-08 1984-05-21 フエアチアイルド・カメラ・アンド・インストルメント・コ−ポレ−シヨン ボンデイングボ−ル形成用の被覆ガス制御
JPS59139637A (ja) * 1983-01-31 1984-08-10 Hitachi Ltd ワイヤボンダ
JPS60213038A (ja) * 1984-04-09 1985-10-25 Toshiba Corp ワイヤボンデイング装置
JPH01280330A (ja) * 1989-03-31 1989-11-10 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPS6126221B2 (ref) 1986-06-19
NL184201B (nl) 1988-12-16
FR2401522A1 (fr) 1979-03-23
US4323759A (en) 1982-04-06
NL7807922A (nl) 1979-01-30
NL184201C (nl) 1989-05-16
GB1600021A (en) 1981-10-14
DE2832050C2 (ref) 1990-01-11
DE2832050A1 (de) 1979-02-15
FR2401522B1 (fr) 1985-08-16

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