JPS54155946A - Method and apparatus for treating metal plate - Google Patents

Method and apparatus for treating metal plate

Info

Publication number
JPS54155946A
JPS54155946A JP6425978A JP6425978A JPS54155946A JP S54155946 A JPS54155946 A JP S54155946A JP 6425978 A JP6425978 A JP 6425978A JP 6425978 A JP6425978 A JP 6425978A JP S54155946 A JPS54155946 A JP S54155946A
Authority
JP
Japan
Prior art keywords
plate
etching
metal plate
chambers
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6425978A
Other languages
Japanese (ja)
Other versions
JPS607709B2 (en
Inventor
Yasuhisa Otake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP6425978A priority Critical patent/JPS607709B2/en
Publication of JPS54155946A publication Critical patent/JPS54155946A/en
Publication of JPS607709B2 publication Critical patent/JPS607709B2/en
Expired legal-status Critical Current

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  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE: To make the size and shape of perforation and etched parts uniform by etching one main side of a metal plate and the other main side, in order, from the lower part by a spray method to eliminate factors such as gathering and flowing of an etching soln. which factors affect product quality.
CONSTITUTION: Etching apparatus 10 consists of first and second etching chambers 6, 7, and many nozzles 31, 32 are set upward in the chambers through manifolds 21, 22. After being developed, dried, and baked, metal plate 1 is wound round drum 14 from drum 11 through drums 12, 13. In chamber 6 an etching soln. is sprayed upon plate 1 from the lower part through nozzles 31 to etch plate 1 to an arbitrary depth. L-shaped sectional or small rollers-contg., U-shaped sectional, acid resistant splash preventing frames 81 or 82 are attached to the parts of plate 1 each ranging from the outside of an effective surface to the side. Next the other side of plate 1 is similarly etched in chamber 7 to form a perforated part.
COPYRIGHT: (C)1979,JPO&Japio
JP6425978A 1978-05-31 1978-05-31 Metal plate processing method and device Expired JPS607709B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6425978A JPS607709B2 (en) 1978-05-31 1978-05-31 Metal plate processing method and device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6425978A JPS607709B2 (en) 1978-05-31 1978-05-31 Metal plate processing method and device

Publications (2)

Publication Number Publication Date
JPS54155946A true JPS54155946A (en) 1979-12-08
JPS607709B2 JPS607709B2 (en) 1985-02-26

Family

ID=13253003

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6425978A Expired JPS607709B2 (en) 1978-05-31 1978-05-31 Metal plate processing method and device

Country Status (1)

Country Link
JP (1) JPS607709B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03277783A (en) * 1990-03-26 1991-12-09 Dainippon Printing Co Ltd Etching method
US5281511A (en) * 1991-08-05 1994-01-25 Gerhardt International A/S Process for producing an embossing die in roll form
JPH06302935A (en) * 1993-04-13 1994-10-28 Yoshisato Tsubaki Etching method for board and etching equipment for board
JP2005220370A (en) * 2004-02-03 2005-08-18 Sony Chem Corp Double-sided etching method and double-sided etching system
JP2018059130A (en) * 2016-09-30 2018-04-12 大日本印刷株式会社 Production method of vapor deposition mask, and production method of metal plate used for producing vapor deposition mask

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6299921B1 (en) 2017-10-13 2018-03-28 凸版印刷株式会社 Vapor deposition mask substrate, vapor deposition mask substrate production method, vapor deposition mask production method, and display device production method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03277783A (en) * 1990-03-26 1991-12-09 Dainippon Printing Co Ltd Etching method
US5281511A (en) * 1991-08-05 1994-01-25 Gerhardt International A/S Process for producing an embossing die in roll form
JPH06302935A (en) * 1993-04-13 1994-10-28 Yoshisato Tsubaki Etching method for board and etching equipment for board
JP2005220370A (en) * 2004-02-03 2005-08-18 Sony Chem Corp Double-sided etching method and double-sided etching system
JP2018059130A (en) * 2016-09-30 2018-04-12 大日本印刷株式会社 Production method of vapor deposition mask, and production method of metal plate used for producing vapor deposition mask

Also Published As

Publication number Publication date
JPS607709B2 (en) 1985-02-26

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