JPS54150972A - Forming method for semiconductor thin film - Google Patents

Forming method for semiconductor thin film

Info

Publication number
JPS54150972A
JPS54150972A JP5895378A JP5895378A JPS54150972A JP S54150972 A JPS54150972 A JP S54150972A JP 5895378 A JP5895378 A JP 5895378A JP 5895378 A JP5895378 A JP 5895378A JP S54150972 A JPS54150972 A JP S54150972A
Authority
JP
Japan
Prior art keywords
layer
thin film
semiconductor thin
insb
polished
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5895378A
Other languages
Japanese (ja)
Other versions
JPS5542494B2 (en
Inventor
Junji Shigeta
Nobuo Kodera
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP5895378A priority Critical patent/JPS54150972A/en
Publication of JPS54150972A publication Critical patent/JPS54150972A/en
Publication of JPS5542494B2 publication Critical patent/JPS5542494B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Crystals, And After-Treatments Of Crystals (AREA)
  • Hall/Mr Elements (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Abstract

PURPOSE: To increase the crystalline property for the low fusing-point semiconductor thin film such as InSb, GaSb, GaxIn1-tSb or the like by giving the zone melting to the semiconductor thin film formed on the substrate in the inactive gas higher than the atmospheric pressure by 0.1kg/cm2.
CONSTITUTION: SiO2 layer 12 is coated on the surface of Ni-Zn ferrite substrate 11 which is mirror-polished; Hall device type groove 17 is drilled through fit-etching; and the entire surface is convered with glass 13 to be used as the foundation of InSb. Then InSb layer 14 and In layer 15 are laminated on glass 13 with coating to then receive the zone melting in the Ar gas higher than the atmosperic pressure by 0.1kg/cm2. After this, the lines caused on the surface and In2O3 layer 16 are polished away, and furthermore other layer 14 is polished away so that layer 14 may remain only within groove 17. With formation of the Hall device in such way, the crystalline property is enhanced to increase the S/N.
COPYRIGHT: (C)1979,JPO&Japio
JP5895378A 1978-05-19 1978-05-19 Forming method for semiconductor thin film Granted JPS54150972A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5895378A JPS54150972A (en) 1978-05-19 1978-05-19 Forming method for semiconductor thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5895378A JPS54150972A (en) 1978-05-19 1978-05-19 Forming method for semiconductor thin film

Publications (2)

Publication Number Publication Date
JPS54150972A true JPS54150972A (en) 1979-11-27
JPS5542494B2 JPS5542494B2 (en) 1980-10-31

Family

ID=13099190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5895378A Granted JPS54150972A (en) 1978-05-19 1978-05-19 Forming method for semiconductor thin film

Country Status (1)

Country Link
JP (1) JPS54150972A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873112A (en) * 1981-10-28 1983-05-02 Nippon Hoso Kyokai <Nhk> Laser annealing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5873112A (en) * 1981-10-28 1983-05-02 Nippon Hoso Kyokai <Nhk> Laser annealing

Also Published As

Publication number Publication date
JPS5542494B2 (en) 1980-10-31

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