JPS54140472A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54140472A
JPS54140472A JP4776978A JP4776978A JPS54140472A JP S54140472 A JPS54140472 A JP S54140472A JP 4776978 A JP4776978 A JP 4776978A JP 4776978 A JP4776978 A JP 4776978A JP S54140472 A JPS54140472 A JP S54140472A
Authority
JP
Japan
Prior art keywords
solder
increase
groove
resin
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4776978A
Other languages
English (en)
Inventor
Hajime Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4776978A priority Critical patent/JPS54140472A/ja
Publication of JPS54140472A publication Critical patent/JPS54140472A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP4776978A 1978-04-24 1978-04-24 Semiconductor device Pending JPS54140472A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4776978A JPS54140472A (en) 1978-04-24 1978-04-24 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4776978A JPS54140472A (en) 1978-04-24 1978-04-24 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54140472A true JPS54140472A (en) 1979-10-31

Family

ID=12784575

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4776978A Pending JPS54140472A (en) 1978-04-24 1978-04-24 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54140472A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258541A (ja) * 2007-04-09 2008-10-23 Nec Electronics Corp 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008258541A (ja) * 2007-04-09 2008-10-23 Nec Electronics Corp 半導体装置及びその製造方法

Similar Documents

Publication Publication Date Title
JPS54140472A (en) Semiconductor device
JPS52138532A (en) Resin composition for adhesive
JPS57211761A (en) Semiconductor device
JPS5212575A (en) Production method of semi-conductor device
JPS54148479A (en) Resin-sealed semiconductor device
JPS5769767A (en) Resin sealed type semiconductor device
JPS5212573A (en) Reed frame
JPS5636145A (en) Thin semiconductor integrated circuit device and its manufacture
JPS57133653A (en) Resin sealed type semiconductor device
JPS54128278A (en) Resin-sealed semiconductor device and its packaging method
JPS53135579A (en) Liquid sealing semiconductor device
JPS54158171A (en) Resin-sealed type semiconductor device
JPS5433665A (en) Manufacture for resin sealed type semiconductor device and resin sealed metal mold
JPS5460564A (en) Resin mold semiconductor device
JPS54128276A (en) Resin-sealed semiconductor device
JPS5527645A (en) Semiconductor device
JPS5480679A (en) Manufacture for semiconductor device
JPS54145476A (en) Package for semiconductor
JPS5372570A (en) Manufacture of semiconductor device
JPS54161271A (en) Semiconductor device
JPS5516439A (en) Resin seal semiconductor device
JPS54160169A (en) Resin-sealed semiconductor device
JPS5480075A (en) Resin sealed semiconductor device and its assembling method
JPS5544763A (en) Semiconductor
JPS5339869A (en) Semiconductor chip mounting base plate