JPS54140472A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS54140472A JPS54140472A JP4776978A JP4776978A JPS54140472A JP S54140472 A JPS54140472 A JP S54140472A JP 4776978 A JP4776978 A JP 4776978A JP 4776978 A JP4776978 A JP 4776978A JP S54140472 A JPS54140472 A JP S54140472A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- increase
- groove
- resin
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4776978A JPS54140472A (en) | 1978-04-24 | 1978-04-24 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4776978A JPS54140472A (en) | 1978-04-24 | 1978-04-24 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54140472A true JPS54140472A (en) | 1979-10-31 |
Family
ID=12784575
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4776978A Pending JPS54140472A (en) | 1978-04-24 | 1978-04-24 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54140472A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008258541A (ja) * | 2007-04-09 | 2008-10-23 | Nec Electronics Corp | 半導体装置及びその製造方法 |
-
1978
- 1978-04-24 JP JP4776978A patent/JPS54140472A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008258541A (ja) * | 2007-04-09 | 2008-10-23 | Nec Electronics Corp | 半導体装置及びその製造方法 |
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