JPS54124681A - Production of resin seal type semiconductor device - Google Patents

Production of resin seal type semiconductor device

Info

Publication number
JPS54124681A
JPS54124681A JP3270278A JP3270278A JPS54124681A JP S54124681 A JPS54124681 A JP S54124681A JP 3270278 A JP3270278 A JP 3270278A JP 3270278 A JP3270278 A JP 3270278A JP S54124681 A JPS54124681 A JP S54124681A
Authority
JP
Japan
Prior art keywords
resin seal
water
production
semiconductor device
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3270278A
Other languages
Japanese (ja)
Inventor
Hideo Tateno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3270278A priority Critical patent/JPS54124681A/en
Publication of JPS54124681A publication Critical patent/JPS54124681A/en
Pending legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To remove easily a thin flash, which is generated at a resin seal time, by jetted flow of liquid or air.
CONSTITUTION: Water is jetted from a nozzle to blow off the thin flash between a resin seal body and a lead. By this method, washing of organic materials becomes needless after processing because dirt is not sticked. Water can be used repeatedly by filtering, and the device can be prevented from being injured. When organic chemicals such as alcohol are used in stead of water, the drying process is shorted, and the drying process becomes needless if the thin flash above can be removed by air.
COPYRIGHT: (C)1979,JPO&Japio
JP3270278A 1978-03-20 1978-03-20 Production of resin seal type semiconductor device Pending JPS54124681A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3270278A JPS54124681A (en) 1978-03-20 1978-03-20 Production of resin seal type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3270278A JPS54124681A (en) 1978-03-20 1978-03-20 Production of resin seal type semiconductor device

Publications (1)

Publication Number Publication Date
JPS54124681A true JPS54124681A (en) 1979-09-27

Family

ID=12366172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3270278A Pending JPS54124681A (en) 1978-03-20 1978-03-20 Production of resin seal type semiconductor device

Country Status (1)

Country Link
JP (1) JPS54124681A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386529A (en) * 1986-09-30 1988-04-16 Toshiba Corp Flash removing device for resin-sealed semiconductor
JP2009189545A (en) * 2008-02-14 2009-08-27 Fujishoji Co Ltd Pachinko game machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6386529A (en) * 1986-09-30 1988-04-16 Toshiba Corp Flash removing device for resin-sealed semiconductor
JP2009189545A (en) * 2008-02-14 2009-08-27 Fujishoji Co Ltd Pachinko game machine

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