JPS54124674A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS54124674A
JPS54124674A JP3269578A JP3269578A JPS54124674A JP S54124674 A JPS54124674 A JP S54124674A JP 3269578 A JP3269578 A JP 3269578A JP 3269578 A JP3269578 A JP 3269578A JP S54124674 A JPS54124674 A JP S54124674A
Authority
JP
Japan
Prior art keywords
electrode
insulating film
internal wiring
wiring layer
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3269578A
Other languages
Japanese (ja)
Inventor
Toshio Kasuga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3269578A priority Critical patent/JPS54124674A/en
Publication of JPS54124674A publication Critical patent/JPS54124674A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13011—Shape comprising apertures or cavities, e.g. hollow bump
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13012—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/1301—Shape
    • H01L2224/13016—Shape in side view
    • H01L2224/13018—Shape in side view comprising protrusions or indentations
    • H01L2224/13019—Shape in side view comprising protrusions or indentations at the bonding interface of the bump connector, i.e. on the surface of the bump connector

Abstract

PURPOSE: To prevent the crack generation of intermediate layers caused by heat and pressure and prevent the generation of inter-metal compound near the electrode part by forming the protruded electrode at the top layer so that this electrode cannot cover the aperture part of the protection insulating film.
CONSTITUTION: Insulating film 12 is provided on one main face of semiconductor substrae 11, and internal wiring layer 13 is provided on this film 12, and protection insulating film 14 which cover internal wiring layer 13 is provided. Next, aperture 15 is provided in protection insulating film 14, and intermediate layer 16 which is conductive to internal wiring layer 14 through aperture 15 and has a part cover protection insulating film 14 is provided. Protruded electrode 17 at the top layer is provided in a D shape so that electrode 17 may be positioned above internal wiring layer 13 approximately and cannot cover the upper part of aperture 15. As a result, cracks caused by heat and pressure at the time when a lead wire is connected to protruded electrode 17 are not generated in intermediate layer 16, and inter-metal compound of the protruded electrode and the internal wiring layer is prevented from being generated, so that reliability can be improved.
COPYRIGHT: (C)1979,JPO&Japio
JP3269578A 1978-03-20 1978-03-20 Semiconductor device Pending JPS54124674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3269578A JPS54124674A (en) 1978-03-20 1978-03-20 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3269578A JPS54124674A (en) 1978-03-20 1978-03-20 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS54124674A true JPS54124674A (en) 1979-09-27

Family

ID=12365980

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3269578A Pending JPS54124674A (en) 1978-03-20 1978-03-20 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS54124674A (en)

Similar Documents

Publication Publication Date Title
JPS5459080A (en) Semiconductor device
JPS54124674A (en) Semiconductor device
JPS52143785A (en) Semiconductor device
JPS551153A (en) Semiconductor fitting device
JPS5516415A (en) Diode
JPS5516449A (en) Semiconductor device
JPS5289468A (en) Semiconductor device
JPS5368970A (en) Solder electrode structure
JPS5481073A (en) Sealing method for semiconductor element
JPS56105670A (en) Semiconductor device
JPS558035A (en) Semiconductor
JPS54113247A (en) Semiconductor device
JPS558084A (en) Semiconductor device
JPS568850A (en) Semiconductor device with metal projection
JPS5220781A (en) Semi-conductor memory unit
JPS5527645A (en) Semiconductor device
JPS5325354A (en) Semiconductor device
JPS5552242A (en) Semiconductor device
JPS5257780A (en) Semiconductor device
JPS57180138A (en) Semiconductor device
JPS5544755A (en) Semiconductor container
JPS5291649A (en) Semiconductor device
JPS6415954A (en) Semiconductor device
JPS51134081A (en) Method to manufacture semiconductor unit
JPS54111760A (en) Electrode construction for semiconductor device