JPS54110786A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS54110786A JPS54110786A JP1738778A JP1738778A JPS54110786A JP S54110786 A JPS54110786 A JP S54110786A JP 1738778 A JP1738778 A JP 1738778A JP 1738778 A JP1738778 A JP 1738778A JP S54110786 A JPS54110786 A JP S54110786A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- pattern
- solder material
- electrode
- adhered
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Die Bonding (AREA)
Abstract
PURPOSE: To avoid the deterioration of the chip and the solder material caused by heat and thus to obtain a highly reliable device by giving the local heating to the area where the semiconductor chip is adhered.
CONSTITUTION: Pattern 3 is formed with gold or the like on alumina support substrate 2 in a larger size than semiconductor chip 1. And solder material 4 smaller than the chip adhering surface is sticked. Parallel gap electric welded electrode 5 is then made to touch the pattern near the both ends of the chip, and the chip is pressed with collet 6 to make electrode 5 conduct. Thus pattern 3 generates heat instantaneously to fuse the solder material, and then the chip is adhered on the pattern by stopping the conduction of the electrode. The solder material is diffused from the center to the periphery of the adhering surface with no sucking of gas or air. Furthermore, the positional accuracy is enhanced, thus preventing the shift of adhesion.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1738778A JPS54110786A (en) | 1978-02-17 | 1978-02-17 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1738778A JPS54110786A (en) | 1978-02-17 | 1978-02-17 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS54110786A true JPS54110786A (en) | 1979-08-30 |
Family
ID=11942580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1738778A Pending JPS54110786A (en) | 1978-02-17 | 1978-02-17 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS54110786A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6078020A (en) * | 1996-11-19 | 2000-06-20 | Nec Corporation | Apparatus and method for manufacturing semiconductor device |
-
1978
- 1978-02-17 JP JP1738778A patent/JPS54110786A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6078020A (en) * | 1996-11-19 | 2000-06-20 | Nec Corporation | Apparatus and method for manufacturing semiconductor device |
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