JPS54110138A - Forming method for high melting point metal thin film - Google Patents

Forming method for high melting point metal thin film

Info

Publication number
JPS54110138A
JPS54110138A JP1662078A JP1662078A JPS54110138A JP S54110138 A JPS54110138 A JP S54110138A JP 1662078 A JP1662078 A JP 1662078A JP 1662078 A JP1662078 A JP 1662078A JP S54110138 A JPS54110138 A JP S54110138A
Authority
JP
Japan
Prior art keywords
thin film
particles
metal
substrate
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1662078A
Other languages
Japanese (ja)
Other versions
JPS5624034B2 (en
Inventor
Susumu Fujimori
Koji Takei
Kazutoshi Nagai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP1662078A priority Critical patent/JPS54110138A/en
Publication of JPS54110138A publication Critical patent/JPS54110138A/en
Publication of JPS5624034B2 publication Critical patent/JPS5624034B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C23C24/10—Coating starting from inorganic powder by application of heat or pressure and heat with intermediate formation of a liquid phase in the layer
    • C23C24/103—Coating with metallic material, i.e. metals or metal alloys, optionally comprising hard particles, e.g. oxides, carbides or nitrides
    • C23C24/106—Coating with metal alloys or metal elements only

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Other Surface Treatments For Metallic Materials (AREA)

Abstract

PURPOSE:To easily obtain an electrical contact point, etc. by dispersing high m.p. metal particles in a low m.p. metal and melting the low m.p. metal by heating to deposit it on a substrate, thereby binding the particles to the substrate to form a thin film. CONSTITUTION:A mixt. of high m.p. metal particles 1 such as Re and low m.p. metal particles 2 such as gold is mounted on substrate 3 and heated with laser beam, etc. for a short time to melt particles 2 alone, thus forming a worked product consisting of low m.p. and high m.p. metals. Particles 1 are then exposed to the product surface by spray polishing, etc. By this method a high m.p. metal thin film can be formed on substrate 3 in a short time.
JP1662078A 1978-02-17 1978-02-17 Forming method for high melting point metal thin film Granted JPS54110138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1662078A JPS54110138A (en) 1978-02-17 1978-02-17 Forming method for high melting point metal thin film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1662078A JPS54110138A (en) 1978-02-17 1978-02-17 Forming method for high melting point metal thin film

Publications (2)

Publication Number Publication Date
JPS54110138A true JPS54110138A (en) 1979-08-29
JPS5624034B2 JPS5624034B2 (en) 1981-06-03

Family

ID=11921370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1662078A Granted JPS54110138A (en) 1978-02-17 1978-02-17 Forming method for high melting point metal thin film

Country Status (1)

Country Link
JP (1) JPS54110138A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017190521A (en) * 2016-04-11 2017-10-19 知宏 前田 Formation method of superimposed fine particle structure, and bonding method of metal and plastic member using the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177536A (en) * 1974-12-28 1976-07-05 Nippon Steel Corp RYOKAKOSEINOHYOMENHIFUKUKOHANNO SEIZOHOHO

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5177536A (en) * 1974-12-28 1976-07-05 Nippon Steel Corp RYOKAKOSEINOHYOMENHIFUKUKOHANNO SEIZOHOHO

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017190521A (en) * 2016-04-11 2017-10-19 知宏 前田 Formation method of superimposed fine particle structure, and bonding method of metal and plastic member using the same

Also Published As

Publication number Publication date
JPS5624034B2 (en) 1981-06-03

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