JPS54102977A - Test method for semiconductor element - Google Patents

Test method for semiconductor element

Info

Publication number
JPS54102977A
JPS54102977A JP1022778A JP1022778A JPS54102977A JP S54102977 A JPS54102977 A JP S54102977A JP 1022778 A JP1022778 A JP 1022778A JP 1022778 A JP1022778 A JP 1022778A JP S54102977 A JPS54102977 A JP S54102977A
Authority
JP
Japan
Prior art keywords
emitter
wire
circuit
transistor
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1022778A
Other languages
Japanese (ja)
Inventor
Masahiro Fukuyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP1022778A priority Critical patent/JPS54102977A/en
Publication of JPS54102977A publication Critical patent/JPS54102977A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To facilitate the detection for the emitter-base short circuit or the emitter opening of the transistor by irradiating the electromagnetic wave to the element when the wire bonding is given to the semiconductor element and utilizing the photoelectric effect caused by the wire bonding. CONSTITUTION:The substrate of transistor 1 which contains base region B and emitter region E to be the collector later is welded onto heat sink 5. Then wire 3 extended from spool 11 is bonded to electrode draw-out layer 9 via capillary 12, and resistance 4 and test voltage generator circuit 13 between wire 3 and heat sink 5 touching the collector. Furthermore, signal process circuit 15 is connected to quality decision circuit 16. While the bonding is being given in such a way, the infrared rays are irradiated to base B and emitter E. And the electromotive force generated through the PN junction at one tip P of resistor 14 is detected to decide the quality of the element.
JP1022778A 1978-01-31 1978-01-31 Test method for semiconductor element Pending JPS54102977A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1022778A JPS54102977A (en) 1978-01-31 1978-01-31 Test method for semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1022778A JPS54102977A (en) 1978-01-31 1978-01-31 Test method for semiconductor element

Publications (1)

Publication Number Publication Date
JPS54102977A true JPS54102977A (en) 1979-08-13

Family

ID=11744385

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1022778A Pending JPS54102977A (en) 1978-01-31 1978-01-31 Test method for semiconductor element

Country Status (1)

Country Link
JP (1) JPS54102977A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134841A (en) * 1982-12-02 1984-08-02 Stanley Electric Co Ltd On-line inspecting method and system for bonding to electronic part
JPS63175439A (en) * 1987-01-16 1988-07-19 Toshiba Corp Manufacture of semiconductor device
JPH0846001A (en) * 1994-07-29 1996-02-16 Nec Corp Method and apparatus for detection of short-circuit position in wiring

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59134841A (en) * 1982-12-02 1984-08-02 Stanley Electric Co Ltd On-line inspecting method and system for bonding to electronic part
JPS63175439A (en) * 1987-01-16 1988-07-19 Toshiba Corp Manufacture of semiconductor device
JPH0846001A (en) * 1994-07-29 1996-02-16 Nec Corp Method and apparatus for detection of short-circuit position in wiring

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