JPS5387170A - Mounting method and mounting device of semiconductor device - Google Patents

Mounting method and mounting device of semiconductor device

Info

Publication number
JPS5387170A
JPS5387170A JP210977A JP210977A JPS5387170A JP S5387170 A JPS5387170 A JP S5387170A JP 210977 A JP210977 A JP 210977A JP 210977 A JP210977 A JP 210977A JP S5387170 A JPS5387170 A JP S5387170A
Authority
JP
Japan
Prior art keywords
mounting
semiconductor device
substrate
mounting method
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP210977A
Other languages
Japanese (ja)
Inventor
Yukihiro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP210977A priority Critical patent/JPS5387170A/en
Publication of JPS5387170A publication Critical patent/JPS5387170A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525—Means for applying energy, e.g. heating means
    • H01L2224/75253—Means for applying energy, e.g. heating means adapted for localised heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/812—Applying energy for connecting
    • H01L2224/8122—Applying energy for connecting with energy being in the form of electromagnetic radiation
    • H01L2224/81224—Applying energy for connecting with energy being in the form of electromagnetic radiation using a laser
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To mount an element to a substrate by radiating artificial beams of a high energy density represented by laser beam to the mounting parts of the substrate element and substrate.
COPYRIGHT: (C)1978,JPO&Japio
JP210977A 1977-01-11 1977-01-11 Mounting method and mounting device of semiconductor device Pending JPS5387170A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP210977A JPS5387170A (en) 1977-01-11 1977-01-11 Mounting method and mounting device of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP210977A JPS5387170A (en) 1977-01-11 1977-01-11 Mounting method and mounting device of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5387170A true JPS5387170A (en) 1978-08-01

Family

ID=11520172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP210977A Pending JPS5387170A (en) 1977-01-11 1977-01-11 Mounting method and mounting device of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5387170A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6411538U (en) * 1987-07-08 1989-01-20

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6411538U (en) * 1987-07-08 1989-01-20

Similar Documents

Publication Publication Date Title
JPS5387170A (en) Mounting method and mounting device of semiconductor device
JPS51149781A (en) Device for mounting semiconductor laserelement
JPS546767A (en) Manufacture of semiconductor device
JPS53116790A (en) Electrical connection method within semiconductor chip
JPS5362477A (en) Electron beam drawing device
JPS51115764A (en) Manufacturing method of a magnetron
JPS52100891A (en) X ray generation method and its device
JPS5267977A (en) Micro pattern fixation method for semiconductor unit
JPS53108281A (en) Manufacture of semiconductor device
JPS53120277A (en) Electron beam exposure device
JPS5295177A (en) Electronic beam mask and manufacture
JPS5244562A (en) Epitaxial growth method
JPS544567A (en) Growing apparatus of ion beam crystal
JPS52117578A (en) Electron beam exposing method
JPS52117569A (en) Electronic beam exposure unit
JPS52119179A (en) Electron beam exposing method
JPS5274288A (en) Production of semiconductor device
JPS53106574A (en) Production of photoetching mask for production of semiconductor device
JPS5361985A (en) Semiconductor laser
JPS52119184A (en) Electron beam exposing method
JPS5299774A (en) Patterning method
JPS5429968A (en) Manufacture of semiconductor device
JPS5211781A (en) Integrated circuit
JPS53105977A (en) Manufacture of semiconductor device
JPS5299793A (en) Semiconductor laser device