JPS5349946A - Formation of swelled electrode - Google Patents

Formation of swelled electrode

Info

Publication number
JPS5349946A
JPS5349946A JP12525976A JP12525976A JPS5349946A JP S5349946 A JPS5349946 A JP S5349946A JP 12525976 A JP12525976 A JP 12525976A JP 12525976 A JP12525976 A JP 12525976A JP S5349946 A JPS5349946 A JP S5349946A
Authority
JP
Japan
Prior art keywords
electrode
swelled
formation
prescribed region
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12525976A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5733861B2 (enExample
Inventor
Hayashi Kuroki
Kunji Higo
Kuniyoshi Fukuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP12525976A priority Critical patent/JPS5349946A/ja
Publication of JPS5349946A publication Critical patent/JPS5349946A/ja
Publication of JPS5733861B2 publication Critical patent/JPS5733861B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)
JP12525976A 1976-10-18 1976-10-18 Formation of swelled electrode Granted JPS5349946A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12525976A JPS5349946A (en) 1976-10-18 1976-10-18 Formation of swelled electrode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12525976A JPS5349946A (en) 1976-10-18 1976-10-18 Formation of swelled electrode

Publications (2)

Publication Number Publication Date
JPS5349946A true JPS5349946A (en) 1978-05-06
JPS5733861B2 JPS5733861B2 (enExample) 1982-07-20

Family

ID=14905656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12525976A Granted JPS5349946A (en) 1976-10-18 1976-10-18 Formation of swelled electrode

Country Status (1)

Country Link
JP (1) JPS5349946A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125838A (ja) * 1984-07-17 1986-02-04 Isao Shoda スタンプ判の加工方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5088978A (enExample) * 1973-12-10 1975-07-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5088978A (enExample) * 1973-12-10 1975-07-17

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6125838A (ja) * 1984-07-17 1986-02-04 Isao Shoda スタンプ判の加工方法

Also Published As

Publication number Publication date
JPS5733861B2 (enExample) 1982-07-20

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