JPS5320194B2 - - Google Patents

Info

Publication number
JPS5320194B2
JPS5320194B2 JP3975972A JP3975972A JPS5320194B2 JP S5320194 B2 JPS5320194 B2 JP S5320194B2 JP 3975972 A JP3975972 A JP 3975972A JP 3975972 A JP3975972 A JP 3975972A JP S5320194 B2 JPS5320194 B2 JP S5320194B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP3975972A
Other languages
Japanese (ja)
Other versions
JPS493580A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3975972A priority Critical patent/JPS5320194B2/ja
Priority to GB1869073A priority patent/GB1427014A/en
Priority to NL7305642A priority patent/NL7305642A/xx
Priority to CA169,182A priority patent/CA985794A/en
Priority to FR7314645A priority patent/FR2181075B1/fr
Priority to DE2320579A priority patent/DE2320579C3/de
Priority to IT24130/73A priority patent/IT1049525B/it
Publication of JPS493580A publication Critical patent/JPS493580A/ja
Priority to US05/520,115 priority patent/US4003072A/en
Publication of JPS5320194B2 publication Critical patent/JPS5320194B2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H10D62/107Buried supplementary regions, e.g. buried guard rings 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D99/00Subject matter not provided for in other groups of this subclass

Landscapes

  • Bipolar Transistors (AREA)
  • Thyristors (AREA)
  • Element Separation (AREA)
JP3975972A 1972-04-20 1972-04-20 Expired JPS5320194B2 (enrdf_load_stackoverflow)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP3975972A JPS5320194B2 (enrdf_load_stackoverflow) 1972-04-20 1972-04-20
GB1869073A GB1427014A (en) 1972-04-20 1973-04-18 Semiconductor devices
NL7305642A NL7305642A (enrdf_load_stackoverflow) 1972-04-20 1973-04-19
CA169,182A CA985794A (en) 1972-04-20 1973-04-19 Semiconductor device with high voltage breakdown resistance
FR7314645A FR2181075B1 (enrdf_load_stackoverflow) 1972-04-20 1973-04-20
DE2320579A DE2320579C3 (de) 1972-04-20 1973-04-21 Schutzanordnung für ein planares Halbleiterbauelement
IT24130/73A IT1049525B (it) 1972-04-20 1973-05-15 Dispositivo semiconduttore con resistenza alle tensioni inverse resistenza alle tensioni inverse di rottura di valore notevolmente elevato
US05/520,115 US4003072A (en) 1972-04-20 1974-11-01 Semiconductor device with high voltage breakdown resistance

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3975972A JPS5320194B2 (enrdf_load_stackoverflow) 1972-04-20 1972-04-20

Publications (2)

Publication Number Publication Date
JPS493580A JPS493580A (enrdf_load_stackoverflow) 1974-01-12
JPS5320194B2 true JPS5320194B2 (enrdf_load_stackoverflow) 1978-06-24

Family

ID=12561864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3975972A Expired JPS5320194B2 (enrdf_load_stackoverflow) 1972-04-20 1972-04-20

Country Status (7)

Country Link
JP (1) JPS5320194B2 (enrdf_load_stackoverflow)
CA (1) CA985794A (enrdf_load_stackoverflow)
DE (1) DE2320579C3 (enrdf_load_stackoverflow)
FR (1) FR2181075B1 (enrdf_load_stackoverflow)
GB (1) GB1427014A (enrdf_load_stackoverflow)
IT (1) IT1049525B (enrdf_load_stackoverflow)
NL (1) NL7305642A (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH594989A5 (enrdf_load_stackoverflow) * 1976-09-03 1978-01-31 Bbc Brown Boveri & Cie
CH633907A5 (de) * 1978-10-10 1982-12-31 Bbc Brown Boveri & Cie Leistungshalbleiterbauelement mit zonen-guard-ringen.
DE3832709A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Thyristor
DE3832750A1 (de) * 1988-09-27 1990-03-29 Asea Brown Boveri Leistungshalbleiterbauelement
GB2237930A (en) * 1989-11-01 1991-05-15 Philips Electronic Associated A semiconductor device and method of manufacturing a semiconductor device
US6011298A (en) * 1996-12-31 2000-01-04 Stmicroelectronics, Inc. High voltage termination with buried field-shaping region
DE19930783A1 (de) * 1999-07-03 2001-01-04 Bosch Gmbh Robert Halbleiterbauelement
GB2403598A (en) * 2000-10-31 2005-01-05 Fuji Electric Co Ltd Semiconductor device
GB2373634B (en) * 2000-10-31 2004-12-08 Fuji Electric Co Ltd Semiconductor device
JP5011611B2 (ja) 2001-06-12 2012-08-29 富士電機株式会社 半導体装置
US9236458B2 (en) * 2013-07-11 2016-01-12 Infineon Technologies Ag Bipolar transistor and a method for manufacturing a bipolar transistor
CN106505092B (zh) * 2016-08-18 2024-05-14 全球能源互联网研究院 一种垂直型半导体器件的双面终端结构

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1030050A (en) * 1963-11-13 1966-05-18 Motorola Inc Punchthrough breakdown rectifier
GB1078273A (en) * 1964-10-19 1967-08-09 Sony Corp Semiconductor device
US3391287A (en) * 1965-07-30 1968-07-02 Westinghouse Electric Corp Guard junctions for p-nu junction semiconductor devices
DE1614751A1 (de) * 1967-01-07 1970-12-03 Telefunken Patent Halbleiteranordnung
DE1789043A1 (de) * 1967-10-14 1972-01-05 Sgs Sa Mit Schutzringen versehene Planar-Halbleitervorrichtungen

Also Published As

Publication number Publication date
FR2181075A1 (enrdf_load_stackoverflow) 1973-11-30
DE2320579A1 (de) 1973-11-08
DE2320579C3 (de) 1983-11-10
NL7305642A (enrdf_load_stackoverflow) 1973-10-23
DE2320579B2 (de) 1976-10-28
FR2181075B1 (enrdf_load_stackoverflow) 1977-12-30
CA985794A (en) 1976-03-16
GB1427014A (en) 1976-03-03
IT1049525B (it) 1981-02-10
JPS493580A (enrdf_load_stackoverflow) 1974-01-12

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