JPS53149762A - Adhering method for thin plate - Google Patents

Adhering method for thin plate

Info

Publication number
JPS53149762A
JPS53149762A JP6397177A JP6397177A JPS53149762A JP S53149762 A JPS53149762 A JP S53149762A JP 6397177 A JP6397177 A JP 6397177A JP 6397177 A JP6397177 A JP 6397177A JP S53149762 A JPS53149762 A JP S53149762A
Authority
JP
Japan
Prior art keywords
thin plate
adhering method
substrate
cement
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6397177A
Other languages
Japanese (ja)
Inventor
Noriyoshi Arakawa
Tsuneo Uga
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6397177A priority Critical patent/JPS53149762A/en
Publication of JPS53149762A publication Critical patent/JPS53149762A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE: To improve adhesion with the film thickness of adhesive cement uniformed, by previously forming a plural number of thin grooves on the adhered surface of a substrate to which a thin plate is adhered, by flow in adhesive cement from one terminal of a groove after pressure-bonding the thin plate to the substrate by means of a mechanical method, and by diffusing the cement to the entire surface through a capillary phenomenon.
COPYRIGHT: (C)1978,JPO&Japio
JP6397177A 1977-06-02 1977-06-02 Adhering method for thin plate Pending JPS53149762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6397177A JPS53149762A (en) 1977-06-02 1977-06-02 Adhering method for thin plate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6397177A JPS53149762A (en) 1977-06-02 1977-06-02 Adhering method for thin plate

Publications (1)

Publication Number Publication Date
JPS53149762A true JPS53149762A (en) 1978-12-27

Family

ID=13244677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6397177A Pending JPS53149762A (en) 1977-06-02 1977-06-02 Adhering method for thin plate

Country Status (1)

Country Link
JP (1) JPS53149762A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013044591A (en) * 2011-08-23 2013-03-04 Ngk Spark Plug Co Ltd Wiring board for electronic component inspection apparatus and method of manufacturing the same
CN113394118A (en) * 2020-03-13 2021-09-14 长鑫存储技术有限公司 Package structure and method for forming the same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826368A (en) * 1971-08-07 1973-04-06
JPS5013630A (en) * 1973-05-09 1975-02-13

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4826368A (en) * 1971-08-07 1973-04-06
JPS5013630A (en) * 1973-05-09 1975-02-13

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013044591A (en) * 2011-08-23 2013-03-04 Ngk Spark Plug Co Ltd Wiring board for electronic component inspection apparatus and method of manufacturing the same
CN113394118A (en) * 2020-03-13 2021-09-14 长鑫存储技术有限公司 Package structure and method for forming the same
CN113394118B (en) * 2020-03-13 2022-03-18 长鑫存储技术有限公司 Package structure and method for forming the same

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