JPS51140560A - Method of monitoring homoepitaxy film thickness - Google Patents
Method of monitoring homoepitaxy film thicknessInfo
- Publication number
- JPS51140560A JPS51140560A JP6431775A JP6431775A JPS51140560A JP S51140560 A JPS51140560 A JP S51140560A JP 6431775 A JP6431775 A JP 6431775A JP 6431775 A JP6431775 A JP 6431775A JP S51140560 A JPS51140560 A JP S51140560A
- Authority
- JP
- Japan
- Prior art keywords
- monitoring
- film thickness
- homoepitaxy
- homoepitaxy film
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
- G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
- G01B11/0675—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating using interferometry
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/16—Controlling or regulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Abstract
PURPOSE: To provide a method of enabling optical film thickness monitoring of the grawing layer in homoepitaxy and rightly controlling the thickness of film by forming a different substance layer in a base plate through driving ions in advance.
COPYRIGHT: (C)1976,JPO&Japio
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6431775A JPS51140560A (en) | 1975-05-30 | 1975-05-30 | Method of monitoring homoepitaxy film thickness |
DE19762623687 DE2623687C3 (en) | 1975-05-30 | 1976-05-26 | Method of measuring the thickness of a layer epitaxially grown on a substrate |
NL7605871A NL7605871A (en) | 1975-05-30 | 1976-05-31 | METHOD OF CHECKING THE THICKNESS OF AN EPITAXIALLY GROWN LAYER ON A SUBSTRATE. |
US05/902,033 US4203799A (en) | 1975-05-30 | 1978-05-02 | Method for monitoring thickness of epitaxial growth layer on substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6431775A JPS51140560A (en) | 1975-05-30 | 1975-05-30 | Method of monitoring homoepitaxy film thickness |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS51140560A true JPS51140560A (en) | 1976-12-03 |
Family
ID=13254725
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6431775A Pending JPS51140560A (en) | 1975-05-30 | 1975-05-30 | Method of monitoring homoepitaxy film thickness |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS51140560A (en) |
DE (1) | DE2623687C3 (en) |
NL (1) | NL7605871A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5555520A (en) * | 1978-10-20 | 1980-04-23 | Hitachi Ltd | Method of controlling thickness of film |
JPS5850737A (en) * | 1981-09-21 | 1983-03-25 | Mitsubishi Electric Corp | Manufacture apparatus for semiconductor element |
JP2019009426A (en) * | 2017-06-27 | 2019-01-17 | 株式会社サイオクス | Method for measuring film thickness, method for manufacturing nitride semiconductor laminate, and nitride semiconductor laminate |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL7605234A (en) * | 1976-05-17 | 1977-11-21 | Philips Nv | PROCEDURE FOR MANUFACTURING A SEMI-CONDUCTOR DEVICE AND SEMI-CONDUCTOR DEVICE MANUFACTURED USING THE PROCESS. |
NL7710164A (en) * | 1977-09-16 | 1979-03-20 | Philips Nv | METHOD OF TREATING A SINGLE CRYSTAL LINE BODY. |
DE3034175A1 (en) * | 1980-09-11 | 1982-04-15 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Chemical deposition of electrically conducting layers - where electrical properties of deposit are used to indicate end of deposition process, esp. in mfg. electronic components |
-
1975
- 1975-05-30 JP JP6431775A patent/JPS51140560A/en active Pending
-
1976
- 1976-05-26 DE DE19762623687 patent/DE2623687C3/en not_active Expired
- 1976-05-31 NL NL7605871A patent/NL7605871A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5555520A (en) * | 1978-10-20 | 1980-04-23 | Hitachi Ltd | Method of controlling thickness of film |
JPS5850737A (en) * | 1981-09-21 | 1983-03-25 | Mitsubishi Electric Corp | Manufacture apparatus for semiconductor element |
JPS6322610B2 (en) * | 1981-09-21 | 1988-05-12 | Mitsubishi Electric Corp | |
JP2019009426A (en) * | 2017-06-27 | 2019-01-17 | 株式会社サイオクス | Method for measuring film thickness, method for manufacturing nitride semiconductor laminate, and nitride semiconductor laminate |
Also Published As
Publication number | Publication date |
---|---|
DE2623687A1 (en) | 1976-12-02 |
NL7605871A (en) | 1976-12-02 |
DE2623687B2 (en) | 1978-08-10 |
DE2623687C3 (en) | 1979-04-19 |
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