JPS53121489A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS53121489A JPS53121489A JP3545477A JP3545477A JPS53121489A JP S53121489 A JPS53121489 A JP S53121489A JP 3545477 A JP3545477 A JP 3545477A JP 3545477 A JP3545477 A JP 3545477A JP S53121489 A JPS53121489 A JP S53121489A
- Authority
- JP
- Japan
- Prior art keywords
- open holes
- insulating film
- semiconductor device
- open
- implanting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3545477A JPS53121489A (en) | 1977-03-31 | 1977-03-31 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3545477A JPS53121489A (en) | 1977-03-31 | 1977-03-31 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53121489A true JPS53121489A (en) | 1978-10-23 |
Family
ID=12442241
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3545477A Pending JPS53121489A (en) | 1977-03-31 | 1977-03-31 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53121489A (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5931041A (ja) * | 1982-08-13 | 1984-02-18 | Seiko Epson Corp | 薄膜半導体装置 |
JPS63229840A (ja) * | 1987-03-19 | 1988-09-26 | Nec Corp | 多層配線の形成方法 |
JPH04290232A (ja) * | 1991-03-19 | 1992-10-14 | Toshiba Corp | 溝埋込み配線形成方法 |
-
1977
- 1977-03-31 JP JP3545477A patent/JPS53121489A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5931041A (ja) * | 1982-08-13 | 1984-02-18 | Seiko Epson Corp | 薄膜半導体装置 |
JPS63229840A (ja) * | 1987-03-19 | 1988-09-26 | Nec Corp | 多層配線の形成方法 |
JPH04290232A (ja) * | 1991-03-19 | 1992-10-14 | Toshiba Corp | 溝埋込み配線形成方法 |
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