JPS53114693A - Moulding method for semiconductor photo detecting device - Google Patents
Moulding method for semiconductor photo detecting deviceInfo
- Publication number
- JPS53114693A JPS53114693A JP3067777A JP3067777A JPS53114693A JP S53114693 A JPS53114693 A JP S53114693A JP 3067777 A JP3067777 A JP 3067777A JP 3067777 A JP3067777 A JP 3067777A JP S53114693 A JPS53114693 A JP S53114693A
- Authority
- JP
- Japan
- Prior art keywords
- photo detecting
- detecting device
- semiconductor photo
- moulding method
- less expensive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Light Receiving Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3067777A JPS53114693A (en) | 1977-03-16 | 1977-03-16 | Moulding method for semiconductor photo detecting device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3067777A JPS53114693A (en) | 1977-03-16 | 1977-03-16 | Moulding method for semiconductor photo detecting device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS53114693A true JPS53114693A (en) | 1978-10-06 |
Family
ID=12310332
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3067777A Pending JPS53114693A (en) | 1977-03-16 | 1977-03-16 | Moulding method for semiconductor photo detecting device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS53114693A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61142778A (ja) * | 1985-12-12 | 1986-06-30 | Rohm Co Ltd | ホトセンサの製造方法 |
-
1977
- 1977-03-16 JP JP3067777A patent/JPS53114693A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61142778A (ja) * | 1985-12-12 | 1986-06-30 | Rohm Co Ltd | ホトセンサの製造方法 |
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