JPS53108885A - Evaporating device - Google Patents

Evaporating device

Info

Publication number
JPS53108885A
JPS53108885A JP2421477A JP2421477A JPS53108885A JP S53108885 A JPS53108885 A JP S53108885A JP 2421477 A JP2421477 A JP 2421477A JP 2421477 A JP2421477 A JP 2421477A JP S53108885 A JPS53108885 A JP S53108885A
Authority
JP
Japan
Prior art keywords
substrate
evaporating device
vaporization source
screening
installing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2421477A
Other languages
Japanese (ja)
Other versions
JPS5928631B2 (en
Inventor
Kenzo Ochi
Osamu Yamazaki
Kiyotaka Wasa
Shigeru Hayakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2421477A priority Critical patent/JPS5928631B2/en
Publication of JPS53108885A publication Critical patent/JPS53108885A/en
Publication of JPS5928631B2 publication Critical patent/JPS5928631B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C23C14/044—Coating on selected surface areas, e.g. using masks using masks using masks to redistribute rather than totally prevent coating, e.g. producing thickness gradient
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:To form the evaporated film having uniform film thickness over the whole surface of the substrate or on plural substrates, by installing the screening body for screening partially the substrate against the vaporization source between the vaporization source and the substrate arranged facing to it.
JP2421477A 1977-03-04 1977-03-04 Vapor deposition equipment Expired JPS5928631B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2421477A JPS5928631B2 (en) 1977-03-04 1977-03-04 Vapor deposition equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2421477A JPS5928631B2 (en) 1977-03-04 1977-03-04 Vapor deposition equipment

Publications (2)

Publication Number Publication Date
JPS53108885A true JPS53108885A (en) 1978-09-22
JPS5928631B2 JPS5928631B2 (en) 1984-07-14

Family

ID=12132036

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2421477A Expired JPS5928631B2 (en) 1977-03-04 1977-03-04 Vapor deposition equipment

Country Status (1)

Country Link
JP (1) JPS5928631B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896873A (en) * 1981-11-27 1983-06-09 バリアン・アソシエイツ・インコ−ポレイテツド Improved blocking seal and method for sputter- coat layer thickness outline
WO2002075014A1 (en) * 2001-03-16 2002-09-26 Optical Coating Laboratory, Inc. Method and apparatus for depositing thin films on vertical surfaces
CN102212779A (en) * 2011-06-15 2011-10-12 星弧涂层科技(苏州工业园区)有限公司 Magnetron sputtering coating device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5896873A (en) * 1981-11-27 1983-06-09 バリアン・アソシエイツ・インコ−ポレイテツド Improved blocking seal and method for sputter- coat layer thickness outline
JPS6154111B2 (en) * 1981-11-27 1986-11-20 Varian Associates
WO2002075014A1 (en) * 2001-03-16 2002-09-26 Optical Coating Laboratory, Inc. Method and apparatus for depositing thin films on vertical surfaces
CN102212779A (en) * 2011-06-15 2011-10-12 星弧涂层科技(苏州工业园区)有限公司 Magnetron sputtering coating device

Also Published As

Publication number Publication date
JPS5928631B2 (en) 1984-07-14

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