JPS53103382A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS53103382A
JPS53103382A JP1830977A JP1830977A JPS53103382A JP S53103382 A JPS53103382 A JP S53103382A JP 1830977 A JP1830977 A JP 1830977A JP 1830977 A JP1830977 A JP 1830977A JP S53103382 A JPS53103382 A JP S53103382A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
time
wafer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1830977A
Other languages
Japanese (ja)
Other versions
JPS5921194B2 (en
Inventor
Mikio Nishihata
Takeshi Suzuki
Michihiro Ito
Hidejiro Miki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP52018309A priority Critical patent/JPS5921194B2/en
Publication of JPS53103382A publication Critical patent/JPS53103382A/en
Publication of JPS5921194B2 publication Critical patent/JPS5921194B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Bipolar Transistors (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To release stress at the time of forming plated heat sinks, reduce warpage at the time working a wafer thinly and achieve the increase in yield by beforehand forming recesses in the wafer surface.
COPYRIGHT: (C)1978,JPO&Japio
JP52018309A 1977-02-21 1977-02-21 Manufacturing method of semiconductor device Expired JPS5921194B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52018309A JPS5921194B2 (en) 1977-02-21 1977-02-21 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52018309A JPS5921194B2 (en) 1977-02-21 1977-02-21 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS53103382A true JPS53103382A (en) 1978-09-08
JPS5921194B2 JPS5921194B2 (en) 1984-05-18

Family

ID=11968004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52018309A Expired JPS5921194B2 (en) 1977-02-21 1977-02-21 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5921194B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122179A (en) * 1986-11-11 1988-05-26 Semiconductor Res Found Manufacture of ultrahigh-frequency semiconductor device and ultrahigh-frequency oscillator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63122179A (en) * 1986-11-11 1988-05-26 Semiconductor Res Found Manufacture of ultrahigh-frequency semiconductor device and ultrahigh-frequency oscillator

Also Published As

Publication number Publication date
JPS5921194B2 (en) 1984-05-18

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