JPS5310270A - Bonding method of ic leads - Google Patents

Bonding method of ic leads

Info

Publication number
JPS5310270A
JPS5310270A JP8399676A JP8399676A JPS5310270A JP S5310270 A JPS5310270 A JP S5310270A JP 8399676 A JP8399676 A JP 8399676A JP 8399676 A JP8399676 A JP 8399676A JP S5310270 A JPS5310270 A JP S5310270A
Authority
JP
Japan
Prior art keywords
leads
bonding
bonding method
lead
conductor end
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8399676A
Other languages
Japanese (ja)
Other versions
JPS5730305B2 (en
Inventor
Hiroshi Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP8399676A priority Critical patent/JPS5310270A/en
Publication of JPS5310270A publication Critical patent/JPS5310270A/en
Publication of JPS5730305B2 publication Critical patent/JPS5730305B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To eliminate wasteful consumption of brazing materials by beforehand fitting a brazing material of a smallest possible quantity required for bonding a lead terminal to the vapor-depostied conductor end on a ceramic substrate to each lead terinal of a lead frame and heating and bonding said material to the conductor end on the substrate.
JP8399676A 1976-07-16 1976-07-16 Bonding method of ic leads Granted JPS5310270A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8399676A JPS5310270A (en) 1976-07-16 1976-07-16 Bonding method of ic leads

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8399676A JPS5310270A (en) 1976-07-16 1976-07-16 Bonding method of ic leads

Publications (2)

Publication Number Publication Date
JPS5310270A true JPS5310270A (en) 1978-01-30
JPS5730305B2 JPS5730305B2 (en) 1982-06-28

Family

ID=13818133

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8399676A Granted JPS5310270A (en) 1976-07-16 1976-07-16 Bonding method of ic leads

Country Status (1)

Country Link
JP (1) JPS5310270A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936747A (en) * 1972-08-09 1974-04-05

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4936747A (en) * 1972-08-09 1974-04-05

Also Published As

Publication number Publication date
JPS5730305B2 (en) 1982-06-28

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