Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Suwa Seikosha KK
Original Assignee
Seiko Epson Corp
Suwa Seikosha KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Suwa Seikosha KKfiledCriticalSeiko Epson Corp
Priority to JP14700375ApriorityCriticalpatent/JPS5937573B2/en
Publication of JPS5271178ApublicationCriticalpatent/JPS5271178A/en
Publication of JPS5937573B2publicationCriticalpatent/JPS5937573B2/en
PURPOSE: To rationalize packaging of a face-down system by automating processes from coating a conductive paste on the electrode extracting areas of semiconductor chips up to bonding of chips on panels.