JPS526468A - Brazing material - Google Patents

Brazing material

Info

Publication number
JPS526468A
JPS526468A JP8288475A JP8288475A JPS526468A JP S526468 A JPS526468 A JP S526468A JP 8288475 A JP8288475 A JP 8288475A JP 8288475 A JP8288475 A JP 8288475A JP S526468 A JPS526468 A JP S526468A
Authority
JP
Japan
Prior art keywords
brazing material
brazing
dyamond
distrotion
friable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8288475A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5649679B2 (cg-RX-API-DMAC10.html
Inventor
Tomio Takahashi
Takeshi Nagasaki
Akira Kuwano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Metal Mining Co Ltd
Original Assignee
Sumitomo Metal Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Metal Mining Co Ltd filed Critical Sumitomo Metal Mining Co Ltd
Priority to JP8288475A priority Critical patent/JPS526468A/ja
Publication of JPS526468A publication Critical patent/JPS526468A/ja
Publication of JPS5649679B2 publication Critical patent/JPS5649679B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP8288475A 1975-07-04 1975-07-04 Brazing material Granted JPS526468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8288475A JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8288475A JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Publications (2)

Publication Number Publication Date
JPS526468A true JPS526468A (en) 1977-01-18
JPS5649679B2 JPS5649679B2 (cg-RX-API-DMAC10.html) 1981-11-24

Family

ID=13786688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8288475A Granted JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Country Status (1)

Country Link
JP (1) JPS526468A (cg-RX-API-DMAC10.html)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device
JPS60177661A (ja) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd 半導体の半田付け方法
US4879096A (en) * 1989-04-19 1989-11-07 Oatey Company Lead- and antimony-free solder composition
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US5532031A (en) * 1992-01-29 1996-07-02 International Business Machines Corporation I/O pad adhesion layer for a ceramic substrate
US6231691B1 (en) 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
CN1090550C (zh) * 1998-04-14 2002-09-11 株式会社村田制作所 焊料合金
JP2007044701A (ja) * 2005-08-05 2007-02-22 Fuji Electric Device Technology Co Ltd 鉛フリー化はんだ材
JP2007260695A (ja) * 2006-03-27 2007-10-11 Toshiba Corp 接合材料、接合方法及び接合体
JP2007268569A (ja) * 2006-03-31 2007-10-18 Fuji Electric Holdings Co Ltd 粉末はんだ材料および接合材料

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6058589U (ja) * 1983-09-30 1985-04-23 日野自動車株式会社 キヤブロツク用アイボルトの取付構造
JP3721073B2 (ja) * 1999-12-28 2005-11-30 株式会社東芝 ハンダ材及びこれを用いたデバイス又は装置並びにその製造方法
WO2015125855A1 (ja) * 2014-02-24 2015-08-27 株式会社弘輝 鉛フリーはんだ合金、はんだ材料及び接合構造体

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219367A1 (ru) * 1967-04-17 1968-05-30 В.П. Батраков Припой дл пайки меди и ее сплавов
JPS4938858A (cg-RX-API-DMAC10.html) * 1972-08-19 1974-04-11

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU219367A1 (ru) * 1967-04-17 1968-05-30 В.П. Батраков Припой дл пайки меди и ее сплавов
JPS4938858A (cg-RX-API-DMAC10.html) * 1972-08-19 1974-04-11

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device
JPS60177661A (ja) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd 半導体の半田付け方法
US4879096A (en) * 1989-04-19 1989-11-07 Oatey Company Lead- and antimony-free solder composition
US5532031A (en) * 1992-01-29 1996-07-02 International Business Machines Corporation I/O pad adhesion layer for a ceramic substrate
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US6231691B1 (en) 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
CN1090550C (zh) * 1998-04-14 2002-09-11 株式会社村田制作所 焊料合金
JP2007044701A (ja) * 2005-08-05 2007-02-22 Fuji Electric Device Technology Co Ltd 鉛フリー化はんだ材
JP2007260695A (ja) * 2006-03-27 2007-10-11 Toshiba Corp 接合材料、接合方法及び接合体
JP2007268569A (ja) * 2006-03-31 2007-10-18 Fuji Electric Holdings Co Ltd 粉末はんだ材料および接合材料

Also Published As

Publication number Publication date
JPS5649679B2 (cg-RX-API-DMAC10.html) 1981-11-24

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