JPS5649679B2 - - Google Patents

Info

Publication number
JPS5649679B2
JPS5649679B2 JP8288475A JP8288475A JPS5649679B2 JP S5649679 B2 JPS5649679 B2 JP S5649679B2 JP 8288475 A JP8288475 A JP 8288475A JP 8288475 A JP8288475 A JP 8288475A JP S5649679 B2 JPS5649679 B2 JP S5649679B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8288475A
Other languages
Japanese (ja)
Other versions
JPS526468A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8288475A priority Critical patent/JPS526468A/ja
Publication of JPS526468A publication Critical patent/JPS526468A/ja
Publication of JPS5649679B2 publication Critical patent/JPS5649679B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP8288475A 1975-07-04 1975-07-04 Brazing material Granted JPS526468A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8288475A JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8288475A JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Publications (2)

Publication Number Publication Date
JPS526468A JPS526468A (en) 1977-01-18
JPS5649679B2 true JPS5649679B2 (cg-RX-API-DMAC10.html) 1981-11-24

Family

ID=13786688

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8288475A Granted JPS526468A (en) 1975-07-04 1975-07-04 Brazing material

Country Status (1)

Country Link
JP (1) JPS526468A (cg-RX-API-DMAC10.html)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6058589U (ja) * 1983-09-30 1985-04-23 日野自動車株式会社 キヤブロツク用アイボルトの取付構造
JP2001246493A (ja) * 1999-12-28 2001-09-11 Toshiba Corp ハンダ材及びこれを用いたデバイス又は装置並びにその製造方法
JPWO2015125855A1 (ja) * 2014-02-24 2017-03-30 株式会社弘輝 鉛フリーはんだ合金、はんだ材料及び接合構造体

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127027A (en) * 1979-03-26 1980-10-01 Toshiba Corp Semiconductor device
JPS60177661A (ja) * 1984-02-23 1985-09-11 Matsushita Electric Ind Co Ltd 半導体の半田付け方法
US4879096A (en) * 1989-04-19 1989-11-07 Oatey Company Lead- and antimony-free solder composition
US5532031A (en) * 1992-01-29 1996-07-02 International Business Machines Corporation I/O pad adhesion layer for a ceramic substrate
US5527628A (en) * 1993-07-20 1996-06-18 Iowa State University Research Foudation, Inc. Pb-free Sn-Ag-Cu ternary eutectic solder
US6231691B1 (en) 1997-02-10 2001-05-15 Iowa State University Research Foundation, Inc. Lead-free solder
JPH11291083A (ja) * 1998-04-14 1999-10-26 Murata Mfg Co Ltd 半田合金
JP2007044701A (ja) * 2005-08-05 2007-02-22 Fuji Electric Device Technology Co Ltd 鉛フリー化はんだ材
JP2007260695A (ja) * 2006-03-27 2007-10-11 Toshiba Corp 接合材料、接合方法及び接合体
JP4722751B2 (ja) * 2006-03-31 2011-07-13 富士電機株式会社 粉末はんだ材料および接合材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS527422B2 (cg-RX-API-DMAC10.html) * 1972-08-19 1977-03-02

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6058589U (ja) * 1983-09-30 1985-04-23 日野自動車株式会社 キヤブロツク用アイボルトの取付構造
JP2001246493A (ja) * 1999-12-28 2001-09-11 Toshiba Corp ハンダ材及びこれを用いたデバイス又は装置並びにその製造方法
JPWO2015125855A1 (ja) * 2014-02-24 2017-03-30 株式会社弘輝 鉛フリーはんだ合金、はんだ材料及び接合構造体

Also Published As

Publication number Publication date
JPS526468A (en) 1977-01-18

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