JPS4938858A - - Google Patents
Info
- Publication number
- JPS4938858A JPS4938858A JP8247372A JP8247372A JPS4938858A JP S4938858 A JPS4938858 A JP S4938858A JP 8247372 A JP8247372 A JP 8247372A JP 8247372 A JP8247372 A JP 8247372A JP S4938858 A JPS4938858 A JP S4938858A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8247372A JPS527422B2 (cg-RX-API-DMAC10.html) | 1972-08-19 | 1972-08-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8247372A JPS527422B2 (cg-RX-API-DMAC10.html) | 1972-08-19 | 1972-08-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS4938858A true JPS4938858A (cg-RX-API-DMAC10.html) | 1974-04-11 |
| JPS527422B2 JPS527422B2 (cg-RX-API-DMAC10.html) | 1977-03-02 |
Family
ID=13775467
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8247372A Expired JPS527422B2 (cg-RX-API-DMAC10.html) | 1972-08-19 | 1972-08-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS527422B2 (cg-RX-API-DMAC10.html) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196268A (cg-RX-API-DMAC10.html) * | 1975-02-20 | 1976-08-24 | ||
| JPS526468A (en) * | 1975-07-04 | 1977-01-18 | Sumitomo Metal Mining Co Ltd | Brazing material |
| EP0629466A1 (en) * | 1993-06-16 | 1994-12-21 | International Business Machines Corporation | High temperature, lead-free, tin based solder composition |
| EP0629464A1 (en) * | 1993-06-16 | 1994-12-21 | International Business Machines Corporation | Lead-free, tin, antimony, bismuth, copper solder alloy |
| JPH071179A (ja) * | 1993-06-16 | 1995-01-06 | Internatl Business Mach Corp <Ibm> | 無鉛すず−ビスマスはんだ合金 |
| JP2017127907A (ja) * | 2015-03-24 | 2017-07-27 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| CN109154036A (zh) * | 2016-05-06 | 2019-01-04 | 爱法组装材料公司 | 高可靠度的无铅焊料合金 |
| DE112020000278T5 (de) | 2019-05-27 | 2021-09-16 | Senju Metal Industry Co., Ltd. | Lotlegierung, lotpaste, lötkugel, lötvorform und lötstelle |
| US11285569B2 (en) | 2003-04-25 | 2022-03-29 | Henkel Ag & Co. Kgaa | Soldering material based on Sn Ag and Cu |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015125855A1 (ja) * | 2014-02-24 | 2015-08-27 | 株式会社弘輝 | 鉛フリーはんだ合金、はんだ材料及び接合構造体 |
-
1972
- 1972-08-19 JP JP8247372A patent/JPS527422B2/ja not_active Expired
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5196268A (cg-RX-API-DMAC10.html) * | 1975-02-20 | 1976-08-24 | ||
| JPS526468A (en) * | 1975-07-04 | 1977-01-18 | Sumitomo Metal Mining Co Ltd | Brazing material |
| JPH0788680A (ja) * | 1993-06-16 | 1995-04-04 | Internatl Business Mach Corp <Ibm> | 高温無鉛すずベースはんだの組成 |
| EP0629464A1 (en) * | 1993-06-16 | 1994-12-21 | International Business Machines Corporation | Lead-free, tin, antimony, bismuth, copper solder alloy |
| JPH071179A (ja) * | 1993-06-16 | 1995-01-06 | Internatl Business Mach Corp <Ibm> | 無鉛すず−ビスマスはんだ合金 |
| JPH0788679A (ja) * | 1993-06-16 | 1995-04-04 | Internatl Business Mach Corp <Ibm> | 無鉛すずアンチモン・ビスマス銅はんだ合金 |
| EP0629466A1 (en) * | 1993-06-16 | 1994-12-21 | International Business Machines Corporation | High temperature, lead-free, tin based solder composition |
| US11285569B2 (en) | 2003-04-25 | 2022-03-29 | Henkel Ag & Co. Kgaa | Soldering material based on Sn Ag and Cu |
| JP2017127907A (ja) * | 2015-03-24 | 2017-07-27 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、電子回路基板および電子制御装置 |
| CN109154036A (zh) * | 2016-05-06 | 2019-01-04 | 爱法组装材料公司 | 高可靠度的无铅焊料合金 |
| JP2019520985A (ja) * | 2016-05-06 | 2019-07-25 | アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． | 高信頼性鉛フリーはんだ合金 |
| EP3449023B1 (en) * | 2016-05-06 | 2022-04-20 | Alpha Assembly Solutions Inc. | High reliability lead-free solder alloy |
| DE112020000278T5 (de) | 2019-05-27 | 2021-09-16 | Senju Metal Industry Co., Ltd. | Lotlegierung, lotpaste, lötkugel, lötvorform und lötstelle |
| US11571770B2 (en) | 2019-05-27 | 2023-02-07 | Senju Metal Industry Co., Ltd. | Solder alloy, solder paste, solder ball, solder preform, and solder joint |
| DE112020000278B4 (de) | 2019-05-27 | 2023-07-06 | Senju Metal Industry Co., Ltd. | Lotlegierung, lotpaste, lötkugel, lötvorform und lötstelle |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS527422B2 (cg-RX-API-DMAC10.html) | 1977-03-02 |