JPS5255390A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS5255390A
JPS5255390A JP13067075A JP13067075A JPS5255390A JP S5255390 A JPS5255390 A JP S5255390A JP 13067075 A JP13067075 A JP 13067075A JP 13067075 A JP13067075 A JP 13067075A JP S5255390 A JPS5255390 A JP S5255390A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
substrate
processses
intricate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13067075A
Other languages
Japanese (ja)
Inventor
Masaru Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP13067075A priority Critical patent/JPS5255390A/en
Publication of JPS5255390A publication Critical patent/JPS5255390A/en
Pending legal-status Critical Current

Links

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To obtain a process for production of a semoconductor device which achieves the improvement in finish accuracy and the savings of intricate processses by providing an oxide film on the rear surface of a semiconductor substrate and forming metal wiring on the front surface of the substrate by electroplating treatment.
COPYRIGHT: (C)1977,JPO&Japio
JP13067075A 1975-10-30 1975-10-30 Production of semiconductor device Pending JPS5255390A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13067075A JPS5255390A (en) 1975-10-30 1975-10-30 Production of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13067075A JPS5255390A (en) 1975-10-30 1975-10-30 Production of semiconductor device

Publications (1)

Publication Number Publication Date
JPS5255390A true JPS5255390A (en) 1977-05-06

Family

ID=15039796

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13067075A Pending JPS5255390A (en) 1975-10-30 1975-10-30 Production of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5255390A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582044A (en) * 1981-06-26 1983-01-07 Seiko Epson Corp Manufacture of semiconductor device
US10344188B2 (en) 2015-12-22 2019-07-09 3M Innovative Properties Company Acrylic polyvinyl acetal films comprising an adhesive layer
US10493738B2 (en) 2015-12-22 2019-12-03 3M Innovative Properties Company Acrylic polyvinyl acetal graphic films

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS582044A (en) * 1981-06-26 1983-01-07 Seiko Epson Corp Manufacture of semiconductor device
JPH0423417B2 (en) * 1981-06-26 1992-04-22 Seiko Epson Corp
US10344188B2 (en) 2015-12-22 2019-07-09 3M Innovative Properties Company Acrylic polyvinyl acetal films comprising an adhesive layer
US10493738B2 (en) 2015-12-22 2019-12-03 3M Innovative Properties Company Acrylic polyvinyl acetal graphic films

Similar Documents

Publication Publication Date Title
JPS5255390A (en) Production of semiconductor device
JPS5248468A (en) Process for production of semiconductor device
JPS5318966A (en) Production of semiconductor integrated circuit
JPS5248972A (en) Circuit board for semiconductor device
JPS5236495A (en) Formation of transparent conductive pattern
JPS52131462A (en) Manufacture of semiconductor device
JPS5267273A (en) Formation of through-hole onto semiconductor substrate
JPS5240061A (en) Semiconductor device and process for production of same
JPS5267271A (en) Formation of through-hole onto semiconductor substrate
JPS525082A (en) Polishing method
JPS5255391A (en) Production of semiconductor device
JPS522171A (en) Electronic parts
JPS533168A (en) Semiconductor evaporating apparatus
JPS5254379A (en) Method of registering front and rear patterns
JPS5249771A (en) Process for production of semiconductor device
JPS5436181A (en) Manufacture for semiconductor device
JPS5384563A (en) Thin film pattern forming method
JPS5242375A (en) Process for production of semiconductor device
JPS5228268A (en) Process for reproduction of minute relief pattern
JPS5251872A (en) Production of semiconductor device
JPS53121468A (en) Manufacture for semiconductor device
JPS5261956A (en) Production of semiconductor device
JPS5361968A (en) Production of semiconductor device
JPS52174A (en) Plasma etching process
JPS5268368A (en) Semiconductor device