JPS5246774A - Process for production of lead frame for semiconductors - Google Patents
Process for production of lead frame for semiconductorsInfo
- Publication number
- JPS5246774A JPS5246774A JP12273675A JP12273675A JPS5246774A JP S5246774 A JPS5246774 A JP S5246774A JP 12273675 A JP12273675 A JP 12273675A JP 12273675 A JP12273675 A JP 12273675A JP S5246774 A JPS5246774 A JP S5246774A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductors
- production
- leads
- consumption
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 239000002390 adhesive tape Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 239000010970 precious metal Substances 0.000 abstract 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12273675A JPS5246774A (en) | 1975-10-11 | 1975-10-11 | Process for production of lead frame for semiconductors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12273675A JPS5246774A (en) | 1975-10-11 | 1975-10-11 | Process for production of lead frame for semiconductors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5246774A true JPS5246774A (en) | 1977-04-13 |
JPS5436072B2 JPS5436072B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-11-07 |
Family
ID=14843307
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12273675A Granted JPS5246774A (en) | 1975-10-11 | 1975-10-11 | Process for production of lead frame for semiconductors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5246774A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6151346A (ja) * | 1984-08-21 | 1986-03-13 | Photo Composing Mach Mfg Co Ltd | 校正用原稿の印字方式 |
JPH0832004A (ja) * | 1994-07-13 | 1996-02-02 | Goto Seisakusho:Kk | 半導体装置用リードフレームのメッキ方法 |
-
1975
- 1975-10-11 JP JP12273675A patent/JPS5246774A/ja active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6151346A (ja) * | 1984-08-21 | 1986-03-13 | Photo Composing Mach Mfg Co Ltd | 校正用原稿の印字方式 |
JPH0832004A (ja) * | 1994-07-13 | 1996-02-02 | Goto Seisakusho:Kk | 半導体装置用リードフレームのメッキ方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS5436072B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1979-11-07 |
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