JPS5227377A - Manufacturing device of semiconductor unit - Google Patents
Manufacturing device of semiconductor unitInfo
- Publication number
- JPS5227377A JPS5227377A JP50103019A JP10301975A JPS5227377A JP S5227377 A JPS5227377 A JP S5227377A JP 50103019 A JP50103019 A JP 50103019A JP 10301975 A JP10301975 A JP 10301975A JP S5227377 A JPS5227377 A JP S5227377A
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing device
- semiconductor unit
- weld
- pellet
- prevented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4823—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a pin of the item
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50103019A JPS5227377A (en) | 1975-08-27 | 1975-08-27 | Manufacturing device of semiconductor unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP50103019A JPS5227377A (en) | 1975-08-27 | 1975-08-27 | Manufacturing device of semiconductor unit |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5227377A true JPS5227377A (en) | 1977-03-01 |
Family
ID=14342925
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50103019A Pending JPS5227377A (en) | 1975-08-27 | 1975-08-27 | Manufacturing device of semiconductor unit |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5227377A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3708960A1 (de) * | 1986-03-20 | 1987-10-01 | Sanyo Electric Co | Elektrisches geraet mit einrichtung zum steuern des einschwingstroms |
-
1975
- 1975-08-27 JP JP50103019A patent/JPS5227377A/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3708960A1 (de) * | 1986-03-20 | 1987-10-01 | Sanyo Electric Co | Elektrisches geraet mit einrichtung zum steuern des einschwingstroms |
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