JPS5226164A - Semi-conductor unit - Google Patents

Semi-conductor unit

Info

Publication number
JPS5226164A
JPS5226164A JP50101242A JP10124275A JPS5226164A JP S5226164 A JPS5226164 A JP S5226164A JP 50101242 A JP50101242 A JP 50101242A JP 10124275 A JP10124275 A JP 10124275A JP S5226164 A JPS5226164 A JP S5226164A
Authority
JP
Japan
Prior art keywords
semi
conductor unit
breaking
prevention
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50101242A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5548699B2 (enExample
Inventor
Akihiro Tomosawa
Masami Kiyono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP50101242A priority Critical patent/JPS5226164A/ja
Publication of JPS5226164A publication Critical patent/JPS5226164A/ja
Publication of JPS5548699B2 publication Critical patent/JPS5548699B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
JP50101242A 1975-08-22 1975-08-22 Semi-conductor unit Granted JPS5226164A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP50101242A JPS5226164A (en) 1975-08-22 1975-08-22 Semi-conductor unit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50101242A JPS5226164A (en) 1975-08-22 1975-08-22 Semi-conductor unit

Publications (2)

Publication Number Publication Date
JPS5226164A true JPS5226164A (en) 1977-02-26
JPS5548699B2 JPS5548699B2 (enExample) 1980-12-08

Family

ID=14295424

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50101242A Granted JPS5226164A (en) 1975-08-22 1975-08-22 Semi-conductor unit

Country Status (1)

Country Link
JP (1) JPS5226164A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56105670A (en) * 1980-01-28 1981-08-22 Mitsubishi Electric Corp Semiconductor device
JPS5821349A (ja) * 1981-07-28 1983-02-08 Toshiba Corp 半導体装置
US5394013A (en) * 1990-11-28 1995-02-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with an elevated bonding pad

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02278624A (ja) * 1989-04-20 1990-11-14 Omron Corp スイッチ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56105670A (en) * 1980-01-28 1981-08-22 Mitsubishi Electric Corp Semiconductor device
JPS5821349A (ja) * 1981-07-28 1983-02-08 Toshiba Corp 半導体装置
US5394013A (en) * 1990-11-28 1995-02-28 Mitsubishi Denki Kabushiki Kaisha Semiconductor device with an elevated bonding pad

Also Published As

Publication number Publication date
JPS5548699B2 (enExample) 1980-12-08

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