JPS5548699B2 - - Google Patents
Info
- Publication number
- JPS5548699B2 JPS5548699B2 JP10124275A JP10124275A JPS5548699B2 JP S5548699 B2 JPS5548699 B2 JP S5548699B2 JP 10124275 A JP10124275 A JP 10124275A JP 10124275 A JP10124275 A JP 10124275A JP S5548699 B2 JPS5548699 B2 JP S5548699B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50101242A JPS5226164A (en) | 1975-08-22 | 1975-08-22 | Semi-conductor unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP50101242A JPS5226164A (en) | 1975-08-22 | 1975-08-22 | Semi-conductor unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5226164A JPS5226164A (en) | 1977-02-26 |
| JPS5548699B2 true JPS5548699B2 (enExample) | 1980-12-08 |
Family
ID=14295424
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP50101242A Granted JPS5226164A (en) | 1975-08-22 | 1975-08-22 | Semi-conductor unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5226164A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02278624A (ja) * | 1989-04-20 | 1990-11-14 | Omron Corp | スイッチ |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56105670A (en) * | 1980-01-28 | 1981-08-22 | Mitsubishi Electric Corp | Semiconductor device |
| JPS5821349A (ja) * | 1981-07-28 | 1983-02-08 | Toshiba Corp | 半導体装置 |
| JPH04196552A (ja) * | 1990-11-28 | 1992-07-16 | Mitsubishi Electric Corp | 半導体装置およびその製造方法 |
-
1975
- 1975-08-22 JP JP50101242A patent/JPS5226164A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02278624A (ja) * | 1989-04-20 | 1990-11-14 | Omron Corp | スイッチ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5226164A (en) | 1977-02-26 |