JPS52155066A - Screening method of thin metal film wirings of semiconductor device - Google Patents

Screening method of thin metal film wirings of semiconductor device

Info

Publication number
JPS52155066A
JPS52155066A JP7254376A JP7254376A JPS52155066A JP S52155066 A JPS52155066 A JP S52155066A JP 7254376 A JP7254376 A JP 7254376A JP 7254376 A JP7254376 A JP 7254376A JP S52155066 A JPS52155066 A JP S52155066A
Authority
JP
Japan
Prior art keywords
metal film
thin metal
semiconductor device
screening method
wirings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7254376A
Other languages
Japanese (ja)
Other versions
JPS5917847B2 (en
Inventor
Heihachi Matsumoto
Kokichi Sawada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP7254376A priority Critical patent/JPS5917847B2/en
Publication of JPS52155066A publication Critical patent/JPS52155066A/en
Publication of JPS5917847B2 publication Critical patent/JPS5917847B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To perform screening of completed devices by beforehand forming thin metal film wirings for monitoring purpose of a required pattern simultaneously during production process at one corner of individual ICs and performing accelerated life test by flowing a large amplitude pulse current to said wirings.
COPYRIGHT: (C)1977,JPO&Japio
JP7254376A 1976-06-18 1976-06-18 Screening method for metal thin film lines in semiconductor devices Expired JPS5917847B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7254376A JPS5917847B2 (en) 1976-06-18 1976-06-18 Screening method for metal thin film lines in semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7254376A JPS5917847B2 (en) 1976-06-18 1976-06-18 Screening method for metal thin film lines in semiconductor devices

Publications (2)

Publication Number Publication Date
JPS52155066A true JPS52155066A (en) 1977-12-23
JPS5917847B2 JPS5917847B2 (en) 1984-04-24

Family

ID=13492367

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7254376A Expired JPS5917847B2 (en) 1976-06-18 1976-06-18 Screening method for metal thin film lines in semiconductor devices

Country Status (1)

Country Link
JP (1) JPS5917847B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683955A (en) * 1979-12-13 1981-07-08 Nec Corp Manufacturing of semiconductor
JPS56172028U (en) * 1980-05-22 1981-12-18
JPS6283677A (en) * 1985-10-08 1987-04-17 Nec Corp Apparatus for testing electromigration

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5683955A (en) * 1979-12-13 1981-07-08 Nec Corp Manufacturing of semiconductor
JPH0147011B2 (en) * 1979-12-13 1989-10-12 Nippon Electric Co
JPS56172028U (en) * 1980-05-22 1981-12-18
JPS6283677A (en) * 1985-10-08 1987-04-17 Nec Corp Apparatus for testing electromigration

Also Published As

Publication number Publication date
JPS5917847B2 (en) 1984-04-24

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