JPS52155050A - Production of semiconductor device - Google Patents

Production of semiconductor device

Info

Publication number
JPS52155050A
JPS52155050A JP7236576A JP7236576A JPS52155050A JP S52155050 A JPS52155050 A JP S52155050A JP 7236576 A JP7236576 A JP 7236576A JP 7236576 A JP7236576 A JP 7236576A JP S52155050 A JPS52155050 A JP S52155050A
Authority
JP
Japan
Prior art keywords
production
semiconductor device
pad electrodes
contamination
occurrence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7236576A
Other languages
Japanese (ja)
Other versions
JPS5915179B2 (en
Inventor
Kenzo Hatada
Kosei Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP51072365A priority Critical patent/JPS5915179B2/en
Publication of JPS52155050A publication Critical patent/JPS52155050A/en
Publication of JPS5915179B2 publication Critical patent/JPS5915179B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE: To prevent the contamination and occurrence of corrosion near pad electrodes by forming an oxide layer near the pad electrodes and providing corrosion resistance against the removing agent for metal films.
COPYRIGHT: (C)1977,JPO&Japio
JP51072365A 1976-06-18 1976-06-18 Manufacturing method of semiconductor device Expired JPS5915179B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51072365A JPS5915179B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51072365A JPS5915179B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS52155050A true JPS52155050A (en) 1977-12-23
JPS5915179B2 JPS5915179B2 (en) 1984-04-07

Family

ID=13487201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51072365A Expired JPS5915179B2 (en) 1976-06-18 1976-06-18 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5915179B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621062A (en) * 1992-05-11 1994-01-28 Internatl Business Mach Corp <Ibm> Metallized composite and semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621062A (en) * 1992-05-11 1994-01-28 Internatl Business Mach Corp <Ibm> Metallized composite and semiconductor device

Also Published As

Publication number Publication date
JPS5915179B2 (en) 1984-04-07

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