JPS52147068A - Plastic molden semiconductor device - Google Patents

Plastic molden semiconductor device

Info

Publication number
JPS52147068A
JPS52147068A JP6348176A JP6348176A JPS52147068A JP S52147068 A JPS52147068 A JP S52147068A JP 6348176 A JP6348176 A JP 6348176A JP 6348176 A JP6348176 A JP 6348176A JP S52147068 A JPS52147068 A JP S52147068A
Authority
JP
Japan
Prior art keywords
molden
plastic
semiconductor device
compound
uretidindion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6348176A
Other languages
Japanese (ja)
Other versions
JPS582456B2 (en
Inventor
Akio Nishikawa
Ataru Yokono
Junji Mukai
Ryuichi Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP51063481A priority Critical patent/JPS582456B2/en
Publication of JPS52147068A publication Critical patent/JPS52147068A/en
Publication of JPS582456B2 publication Critical patent/JPS582456B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Polyurethanes Or Polyureas (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To increase the stability in high temperature and high humidity by sealing an element with thermosetting resin composed of compound having uretidindion epoxy compound and kaliborate.
COPYRIGHT: (C)1977,JPO&Japio
JP51063481A 1976-06-02 1976-06-02 Resin-encapsulated semiconductor device Expired JPS582456B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP51063481A JPS582456B2 (en) 1976-06-02 1976-06-02 Resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51063481A JPS582456B2 (en) 1976-06-02 1976-06-02 Resin-encapsulated semiconductor device

Publications (2)

Publication Number Publication Date
JPS52147068A true JPS52147068A (en) 1977-12-07
JPS582456B2 JPS582456B2 (en) 1983-01-17

Family

ID=13230460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51063481A Expired JPS582456B2 (en) 1976-06-02 1976-06-02 Resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS582456B2 (en)

Also Published As

Publication number Publication date
JPS582456B2 (en) 1983-01-17

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