JPS52131785A - Ultrasonic wire bonding device - Google Patents

Ultrasonic wire bonding device

Info

Publication number
JPS52131785A
JPS52131785A JP4772676A JP4772676A JPS52131785A JP S52131785 A JPS52131785 A JP S52131785A JP 4772676 A JP4772676 A JP 4772676A JP 4772676 A JP4772676 A JP 4772676A JP S52131785 A JPS52131785 A JP S52131785A
Authority
JP
Japan
Prior art keywords
wire bonding
bonding device
ultrasonic wire
controlling
ultrasonic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4772676A
Other languages
English (en)
Japanese (ja)
Other versions
JPS579494B2 (enExample
Inventor
Shunei Uematsu
Shunichiro Fujioka
Michio Tanimoto
Ryuichi Kyomasu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4772676A priority Critical patent/JPS52131785A/ja
Publication of JPS52131785A publication Critical patent/JPS52131785A/ja
Publication of JPS579494B2 publication Critical patent/JPS579494B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP4772676A 1976-04-28 1976-04-28 Ultrasonic wire bonding device Granted JPS52131785A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4772676A JPS52131785A (en) 1976-04-28 1976-04-28 Ultrasonic wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4772676A JPS52131785A (en) 1976-04-28 1976-04-28 Ultrasonic wire bonding device

Publications (2)

Publication Number Publication Date
JPS52131785A true JPS52131785A (en) 1977-11-04
JPS579494B2 JPS579494B2 (enExample) 1982-02-22

Family

ID=12783324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4772676A Granted JPS52131785A (en) 1976-04-28 1976-04-28 Ultrasonic wire bonding device

Country Status (1)

Country Link
JP (1) JPS52131785A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120145A (en) * 1979-03-12 1980-09-16 Chiyou Lsi Gijutsu Kenkyu Kumiai Bonding apparatus

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120145A (en) * 1979-03-12 1980-09-16 Chiyou Lsi Gijutsu Kenkyu Kumiai Bonding apparatus

Also Published As

Publication number Publication date
JPS579494B2 (enExample) 1982-02-22

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