JPS55120145A - Bonding apparatus - Google Patents

Bonding apparatus

Info

Publication number
JPS55120145A
JPS55120145A JP2844379A JP2844379A JPS55120145A JP S55120145 A JPS55120145 A JP S55120145A JP 2844379 A JP2844379 A JP 2844379A JP 2844379 A JP2844379 A JP 2844379A JP S55120145 A JPS55120145 A JP S55120145A
Authority
JP
Japan
Prior art keywords
tool
output
bonding
energy
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2844379A
Other languages
Japanese (ja)
Inventor
Mitsuru Nitta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Original Assignee
CHIYOU LSI GIJUTSU KENKYU KUMIAI
CHO LSI GIJUTSU KENKYU KUMIAI
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CHIYOU LSI GIJUTSU KENKYU KUMIAI, CHO LSI GIJUTSU KENKYU KUMIAI filed Critical CHIYOU LSI GIJUTSU KENKYU KUMIAI
Priority to JP2844379A priority Critical patent/JPS55120145A/en
Publication of JPS55120145A publication Critical patent/JPS55120145A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To provide a highly reliable connection of an article to another article by a bonding apparatus by detecting energy transmitted to a bonding tool by a detector and controlling the ultrasonic output from the tool to reduce the variation of the energy. CONSTITUTION:The vibration of a bonding tool 4 is transmitted to an article 6, and ultrasonic energy from the tool 4 is thus applied to the bonding surface of another article 7. A detector 51 detects the ultrasonic vibration of the tool 4 and produces an output to an amplifier 52, which amplifiers the output and applies it to an oscillator 1 to control the output from the oscillator 1. The bonding apparatus thus constructed can correct the variabtions in the characteristics of the circuit and the material due to the laterations of the load and the temperature of the tool and further the variations in the ultrasonic vibration energy due to the alteration of the power supply so as to bond the articles with high reliability.
JP2844379A 1979-03-12 1979-03-12 Bonding apparatus Pending JPS55120145A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2844379A JPS55120145A (en) 1979-03-12 1979-03-12 Bonding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2844379A JPS55120145A (en) 1979-03-12 1979-03-12 Bonding apparatus

Publications (1)

Publication Number Publication Date
JPS55120145A true JPS55120145A (en) 1980-09-16

Family

ID=12248814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2844379A Pending JPS55120145A (en) 1979-03-12 1979-03-12 Bonding apparatus

Country Status (1)

Country Link
JP (1) JPS55120145A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6283588U (en) * 1985-11-11 1987-05-28
US5431324A (en) * 1992-01-24 1995-07-11 Hitachi, Ltd. Ultrasonic bonding apparatus and quality monitoring method

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146350A (en) * 1975-06-11 1976-12-15 Hitachi Ltd Ultrasonic wire bonding device
JPS52131785A (en) * 1976-04-28 1977-11-04 Hitachi Ltd Ultrasonic wire bonding device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51146350A (en) * 1975-06-11 1976-12-15 Hitachi Ltd Ultrasonic wire bonding device
JPS52131785A (en) * 1976-04-28 1977-11-04 Hitachi Ltd Ultrasonic wire bonding device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6283588U (en) * 1985-11-11 1987-05-28
JPH0523266Y2 (en) * 1985-11-11 1993-06-15
US5431324A (en) * 1992-01-24 1995-07-11 Hitachi, Ltd. Ultrasonic bonding apparatus and quality monitoring method

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