JPS579494B2 - - Google Patents

Info

Publication number
JPS579494B2
JPS579494B2 JP4772676A JP4772676A JPS579494B2 JP S579494 B2 JPS579494 B2 JP S579494B2 JP 4772676 A JP4772676 A JP 4772676A JP 4772676 A JP4772676 A JP 4772676A JP S579494 B2 JPS579494 B2 JP S579494B2
Authority
JP
Japan
Prior art keywords
controlling
oscilaltion
attenuating
vibrator
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4772676A
Other languages
English (en)
Japanese (ja)
Other versions
JPS52131785A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4772676A priority Critical patent/JPS52131785A/ja
Publication of JPS52131785A publication Critical patent/JPS52131785A/ja
Publication of JPS579494B2 publication Critical patent/JPS579494B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped

Landscapes

  • Wire Bonding (AREA)
JP4772676A 1976-04-28 1976-04-28 Ultrasonic wire bonding device Granted JPS52131785A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4772676A JPS52131785A (en) 1976-04-28 1976-04-28 Ultrasonic wire bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4772676A JPS52131785A (en) 1976-04-28 1976-04-28 Ultrasonic wire bonding device

Publications (2)

Publication Number Publication Date
JPS52131785A JPS52131785A (en) 1977-11-04
JPS579494B2 true JPS579494B2 (enExample) 1982-02-22

Family

ID=12783324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4772676A Granted JPS52131785A (en) 1976-04-28 1976-04-28 Ultrasonic wire bonding device

Country Status (1)

Country Link
JP (1) JPS52131785A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55120145A (en) * 1979-03-12 1980-09-16 Chiyou Lsi Gijutsu Kenkyu Kumiai Bonding apparatus

Also Published As

Publication number Publication date
JPS52131785A (en) 1977-11-04

Similar Documents

Publication Publication Date Title
JPS579494B2 (enExample)
JPS5214340A (en) Voltage controlled type multivibrator
JPS5222748A (en) Zero volt switching power regulator
JPS5318896A (en) Electrospark machining method
JPS5383193A (en) Marking-off method in use of laser beam
JPS52133660A (en) Industrial robot
JPS51145209A (en) Amplifier
JPS5232697A (en) Laser oscillation equipment
JPS5357955A (en) Reset method for flip flop circuit
JPS5333346A (en) Controlling power supply circuit
JPS5383473A (en) Thyristor
JPS5213761A (en) Flip-flop circuit
JPS5373984A (en) Semiconductor laser and its driving method
JPS5419381A (en) Semiconductor device
JPS5222991A (en) Method of controlling plasma type ion source
JPS5214998A (en) Device for electric machining using wire electrode
JPS5289892A (en) Electro-erosion method
JPS52131378A (en) Method of controlling stacker crane
JPS5252385A (en) Thickness sliding crystal vibrator
JPS51133894A (en) Wire-electrode electrical dischar ge machining device
JPS5310221A (en) Protective device for output circuit
JPS536050A (en) Optical deflector
JPS5338206A (en) Switch driver circuit
JPS5222458A (en) Delay circuit
JPS538551A (en) Negative feedback amplifier