JPS52131460A - Lead wire for semiconductor device - Google Patents

Lead wire for semiconductor device

Info

Publication number
JPS52131460A
JPS52131460A JP4882376A JP4882376A JPS52131460A JP S52131460 A JPS52131460 A JP S52131460A JP 4882376 A JP4882376 A JP 4882376A JP 4882376 A JP4882376 A JP 4882376A JP S52131460 A JPS52131460 A JP S52131460A
Authority
JP
Japan
Prior art keywords
lead wire
semiconductor device
metallurgical
secure
easy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4882376A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5641176B2 (enExample
Inventor
Hiroshi Ishibe
Nobuo Ogasa
Akira Otsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Electric Industries Ltd
Original Assignee
Sumitomo Electric Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Electric Industries Ltd filed Critical Sumitomo Electric Industries Ltd
Priority to JP4882376A priority Critical patent/JPS52131460A/ja
Publication of JPS52131460A publication Critical patent/JPS52131460A/ja
Publication of JPS5641176B2 publication Critical patent/JPS5641176B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP4882376A 1976-04-28 1976-04-28 Lead wire for semiconductor device Granted JPS52131460A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4882376A JPS52131460A (en) 1976-04-28 1976-04-28 Lead wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4882376A JPS52131460A (en) 1976-04-28 1976-04-28 Lead wire for semiconductor device

Publications (2)

Publication Number Publication Date
JPS52131460A true JPS52131460A (en) 1977-11-04
JPS5641176B2 JPS5641176B2 (enExample) 1981-09-26

Family

ID=12813933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4882376A Granted JPS52131460A (en) 1976-04-28 1976-04-28 Lead wire for semiconductor device

Country Status (1)

Country Link
JP (1) JPS52131460A (enExample)

Also Published As

Publication number Publication date
JPS5641176B2 (enExample) 1981-09-26

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