JPS52128066A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS52128066A
JPS52128066A JP4510076A JP4510076A JPS52128066A JP S52128066 A JPS52128066 A JP S52128066A JP 4510076 A JP4510076 A JP 4510076A JP 4510076 A JP4510076 A JP 4510076A JP S52128066 A JPS52128066 A JP S52128066A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
substrate
injecting
changing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4510076A
Other languages
English (en)
Inventor
Seiji Ishikawa
Kunio Ito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP4510076A priority Critical patent/JPS52128066A/ja
Priority to US05/787,427 priority patent/US4108715A/en
Publication of JPS52128066A publication Critical patent/JPS52128066A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/2654—Bombardment with radiation with high-energy radiation producing ion implantation in AIIIBV compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
    • H01L21/266—Bombardment with radiation with high-energy radiation producing ion implantation using masks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30604—Chemical etching
    • H01L21/30612—Etching of AIIIBV compounds
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S438/00—Semiconductor device manufacturing: process
    • Y10S438/98—Utilizing process equivalents or options

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Weting (AREA)
  • Drying Of Semiconductors (AREA)
JP4510076A 1976-04-20 1976-04-20 Manufacture of semiconductor device Pending JPS52128066A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP4510076A JPS52128066A (en) 1976-04-20 1976-04-20 Manufacture of semiconductor device
US05/787,427 US4108715A (en) 1976-04-20 1977-04-14 Method for machining surfaces of semiconductor substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4510076A JPS52128066A (en) 1976-04-20 1976-04-20 Manufacture of semiconductor device

Publications (1)

Publication Number Publication Date
JPS52128066A true JPS52128066A (en) 1977-10-27

Family

ID=12709864

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4510076A Pending JPS52128066A (en) 1976-04-20 1976-04-20 Manufacture of semiconductor device

Country Status (2)

Country Link
US (1) US4108715A (ja)
JP (1) JPS52128066A (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650514A (en) * 1979-10-01 1981-05-07 Mitsubishi Electric Corp Formation of fine pattern
JPS6328067A (ja) * 1986-07-22 1988-02-05 Sony Corp 半導体装置の製造方法
JPH07126905A (ja) * 1993-10-25 1995-05-16 Kijima:Kk 手袋の製造方法
JP2008300833A (ja) * 2007-05-29 2008-12-11 Qimonda Ag 基板上または基板内に構造物を形成する方法、サブリソグラフィック構造物を生成するためのイメージング層、サブリソグラフィックパターンを反転させる方法、構造物を製造することによって得られるデバイス

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1588669A (en) * 1978-05-30 1981-04-29 Standard Telephones Cables Ltd Silicon transducer
JPS5839374B2 (ja) * 1978-12-26 1983-08-30 松下電器産業株式会社 半導体基板の処理方法
JPS5656636A (en) * 1979-10-13 1981-05-18 Mitsubishi Electric Corp Processing method of fine pattern
JPS5679449A (en) * 1979-11-30 1981-06-30 Mitsubishi Electric Corp Production of semiconductor device
US4343675A (en) * 1980-09-30 1982-08-10 The United States Of America As Represented By The United States Department Of Energy Method of manufacturing hollow members having uniform wall thickness through use of ablation
US4343676A (en) * 1981-03-26 1982-08-10 Rca Corporation Etching a semiconductor material and automatically stopping same
US4377437A (en) * 1981-05-22 1983-03-22 Bell Telephone Laboratories, Incorporated Device lithography by selective ion implantation
US4515654A (en) * 1982-07-06 1985-05-07 General Electric Company Method for making semiconductor devices utilizing eutectic masks
JPS59136977A (ja) * 1983-01-26 1984-08-06 Hitachi Ltd 圧力感知半導体装置とその製造法
NL8301262A (nl) * 1983-04-11 1984-11-01 Philips Nv Werkwijze voor het vervaardigen van een halfgeleiderinrichting, waarbij met behulp van ionenimplantatie patronen worden aangebracht in een laag siliciumnitride.
US4554728A (en) * 1984-06-27 1985-11-26 International Business Machines Corporation Simplified planarization process for polysilicon filled trenches
NL8402859A (nl) * 1984-09-18 1986-04-16 Philips Nv Werkwijze voor het vervaardigen van submicrongroeven in bijvoorbeeld halfgeleidermateriaal en met deze werkwijze verkregen inrichtingen.
US4952446A (en) * 1986-02-10 1990-08-28 Cornell Research Foundation, Inc. Ultra-thin semiconductor membranes
US4946735A (en) * 1986-02-10 1990-08-07 Cornell Research Foundation, Inc. Ultra-thin semiconductor membranes
US5136344A (en) * 1988-11-02 1992-08-04 Universal Energy Systems, Inc. High energy ion implanted silicon on insulator structure
US5436174A (en) * 1993-01-25 1995-07-25 North Carolina State University Method of forming trenches in monocrystalline silicon carbide
US6309975B1 (en) 1997-03-14 2001-10-30 Micron Technology, Inc. Methods of making implanted structures
US20150206789A1 (en) * 2014-01-17 2015-07-23 Nanya Technology Corporation Method of modifying polysilicon layer through nitrogen incorporation for isolation structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2989385A (en) * 1957-05-14 1961-06-20 Bell Telephone Labor Inc Process for ion bombarding and etching metal
US3976511A (en) * 1975-06-30 1976-08-24 Ibm Corporation Method for fabricating integrated circuit structures with full dielectric isolation by ion bombardment
US4026740A (en) * 1975-10-29 1977-05-31 Intel Corporation Process for fabricating narrow polycrystalline silicon members

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5650514A (en) * 1979-10-01 1981-05-07 Mitsubishi Electric Corp Formation of fine pattern
JPS6328067A (ja) * 1986-07-22 1988-02-05 Sony Corp 半導体装置の製造方法
JPH07126905A (ja) * 1993-10-25 1995-05-16 Kijima:Kk 手袋の製造方法
JP2008300833A (ja) * 2007-05-29 2008-12-11 Qimonda Ag 基板上または基板内に構造物を形成する方法、サブリソグラフィック構造物を生成するためのイメージング層、サブリソグラフィックパターンを反転させる方法、構造物を製造することによって得られるデバイス

Also Published As

Publication number Publication date
US4108715A (en) 1978-08-22

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