JPS52119953A - Displacement converter using semiconductor strain gauges - Google Patents

Displacement converter using semiconductor strain gauges

Info

Publication number
JPS52119953A
JPS52119953A JP3595876A JP3595876A JPS52119953A JP S52119953 A JPS52119953 A JP S52119953A JP 3595876 A JP3595876 A JP 3595876A JP 3595876 A JP3595876 A JP 3595876A JP S52119953 A JPS52119953 A JP S52119953A
Authority
JP
Japan
Prior art keywords
strain gauges
semiconductor strain
displacement converter
displacement
strain gauge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3595876A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5611085B2 (OSRAM
Inventor
Satoshi Shimada
Yasutoshi Kurihara
Teruyuki Kagami
Yasumasa Matsuda
Tetsuo Kosugi
Kazuji Yamada
Yasuo Matsushita
Michitaka Shimazoe
Kosuke Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3595876A priority Critical patent/JPS52119953A/ja
Publication of JPS52119953A publication Critical patent/JPS52119953A/ja
Publication of JPS5611085B2 publication Critical patent/JPS5611085B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Transmission And Conversion Of Sensor Element Output (AREA)
  • Die Bonding (AREA)
JP3595876A 1976-04-02 1976-04-02 Displacement converter using semiconductor strain gauges Granted JPS52119953A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3595876A JPS52119953A (en) 1976-04-02 1976-04-02 Displacement converter using semiconductor strain gauges

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3595876A JPS52119953A (en) 1976-04-02 1976-04-02 Displacement converter using semiconductor strain gauges

Publications (2)

Publication Number Publication Date
JPS52119953A true JPS52119953A (en) 1977-10-07
JPS5611085B2 JPS5611085B2 (OSRAM) 1981-03-12

Family

ID=12456470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3595876A Granted JPS52119953A (en) 1976-04-02 1976-04-02 Displacement converter using semiconductor strain gauges

Country Status (1)

Country Link
JP (1) JPS52119953A (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63226074A (ja) * 1986-10-30 1988-09-20 Ricoh Co Ltd 力検出装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953377A (OSRAM) * 1972-09-25 1974-05-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4953377A (OSRAM) * 1972-09-25 1974-05-23

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63226074A (ja) * 1986-10-30 1988-09-20 Ricoh Co Ltd 力検出装置

Also Published As

Publication number Publication date
JPS5611085B2 (OSRAM) 1981-03-12

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