JPS52115173A - Mounting method for semiconductor device - Google Patents

Mounting method for semiconductor device

Info

Publication number
JPS52115173A
JPS52115173A JP3125076A JP3125076A JPS52115173A JP S52115173 A JPS52115173 A JP S52115173A JP 3125076 A JP3125076 A JP 3125076A JP 3125076 A JP3125076 A JP 3125076A JP S52115173 A JPS52115173 A JP S52115173A
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting method
cracking
screws
fastening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3125076A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5330990B2 (enExample
Inventor
Susumu Okikawa
Hiroshi Mikino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP3125076A priority Critical patent/JPS52115173A/ja
Priority to DE2712543A priority patent/DE2712543C2/de
Priority to US05/780,327 priority patent/US4100566A/en
Publication of JPS52115173A publication Critical patent/JPS52115173A/ja
Publication of JPS5330990B2 publication Critical patent/JPS5330990B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP3125076A 1976-03-24 1976-03-24 Mounting method for semiconductor device Granted JPS52115173A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP3125076A JPS52115173A (en) 1976-03-24 1976-03-24 Mounting method for semiconductor device
DE2712543A DE2712543C2 (de) 1976-03-24 1977-03-22 Anordnung eines Halbleiterbauelements auf einer Montageplatte
US05/780,327 US4100566A (en) 1976-03-24 1977-03-23 Resin-sealed type semiconductor devices and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3125076A JPS52115173A (en) 1976-03-24 1976-03-24 Mounting method for semiconductor device

Publications (2)

Publication Number Publication Date
JPS52115173A true JPS52115173A (en) 1977-09-27
JPS5330990B2 JPS5330990B2 (enExample) 1978-08-30

Family

ID=12326109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3125076A Granted JPS52115173A (en) 1976-03-24 1976-03-24 Mounting method for semiconductor device

Country Status (1)

Country Link
JP (1) JPS52115173A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023057597A (ja) * 2021-10-12 2023-04-24 富士電機株式会社 半導体モジュール

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023057597A (ja) * 2021-10-12 2023-04-24 富士電機株式会社 半導体モジュール

Also Published As

Publication number Publication date
JPS5330990B2 (enExample) 1978-08-30

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