JPS516678A - - Google Patents

Info

Publication number
JPS516678A
JPS516678A JP50066658A JP6665875A JPS516678A JP S516678 A JPS516678 A JP S516678A JP 50066658 A JP50066658 A JP 50066658A JP 6665875 A JP6665875 A JP 6665875A JP S516678 A JPS516678 A JP S516678A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50066658A
Other versions
JPS5932740B2 (ja
Inventor
Bo Ronarudo
Kosutenko Junia Arekusandaa
Jei Tsukazuitsuku Juni Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS516678A publication Critical patent/JPS516678A/ja
Publication of JPS5932740B2 publication Critical patent/JPS5932740B2/ja
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP50066658A 1974-06-28 1975-06-04 同軸配列スペ−ス変換器 Expired JPS5932740B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US484052A US3911361A (en) 1974-06-28 1974-06-28 Coaxial array space transformer
US484052 1974-06-28

Publications (2)

Publication Number Publication Date
JPS516678A true JPS516678A (ja) 1976-01-20
JPS5932740B2 JPS5932740B2 (ja) 1984-08-10

Family

ID=23922539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50066658A Expired JPS5932740B2 (ja) 1974-06-28 1975-06-04 同軸配列スペ−ス変換器

Country Status (5)

Country Link
US (1) US3911361A (ja)
JP (1) JPS5932740B2 (ja)
DE (1) DE2525166C2 (ja)
FR (1) FR2275781A1 (ja)
IT (1) IT1038694B (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5295182A (en) * 1976-02-06 1977-08-10 Nippon Telegr & Teleph Corp <Ntt> Measurement for high frequency characteristics of transistor wafer
JPS5395770U (ja) * 1976-12-30 1978-08-04
JPS5574047U (ja) * 1978-11-13 1980-05-21
JPS57204472A (en) * 1981-06-05 1982-12-15 Maikuro Component Tekunorojii Electric connector to electric device
JPS58120652U (ja) * 1982-02-08 1983-08-17 日本電子材料株式会社 プロ−ブカ−ド
JPS5911444U (ja) * 1982-07-13 1984-01-24 日本電子材料株式会社 プロ−ブカ−ド
JPS5972148A (ja) * 1982-09-14 1984-04-24 アキユテスト・コ−ポレ−シヨン 電子回路ウエ−ハ−検査装置
JPS60116244U (ja) * 1984-01-13 1985-08-06 日本電子材料株式会社 プロ−ブカ−ド
JPS6156981A (ja) * 1984-08-27 1986-03-22 Nec Corp 半導体検査装置
JPS6180067A (ja) * 1984-09-21 1986-04-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション テスト・プロ−ブ装置
JP2013250145A (ja) * 2012-05-31 2013-12-12 Tokyo Cathode Laboratory Co Ltd プローブカード

Families Citing this family (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4045735A (en) * 1976-02-17 1977-08-30 E-H Research Laboratories, Inc. Apparatus for testing electronic devices having a high density array of pin leads
US4523144A (en) * 1980-05-27 1985-06-11 Japan Electronic Materials Corp. Complex probe card for testing a semiconductor wafer
US4554506A (en) * 1981-06-30 1985-11-19 International Business Machines Corporation Modular test probe
US4566184A (en) * 1981-08-24 1986-01-28 Rockwell International Corporation Process for making a probe for high speed integrated circuits
US4719417A (en) * 1983-05-03 1988-01-12 Wentworth Laboratories, Inc. Multi-level test probe assembly for IC chips
US4554505A (en) * 1983-06-10 1985-11-19 Rockwell International Corporation Test socket for a leadless chip carrier
DE3340179C1 (de) * 1983-11-07 1985-05-09 MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH Anordnung an einem Leiterplattenpruefgeraet zur Anpassung der Abstaende von Kontakten
US4734046A (en) * 1984-09-21 1988-03-29 International Business Machines Corporation Coaxial converter with resilient terminal
US4757256A (en) * 1985-05-10 1988-07-12 Micro-Probe, Inc. High density probe card
DE3750692D1 (de) * 1986-10-14 1994-12-01 Feinmetall Gmbh Nadelkarte.
US4918383A (en) * 1987-01-20 1990-04-17 Huff Richard E Membrane probe with automatic contact scrub action
US4812745A (en) * 1987-05-29 1989-03-14 Teradyne, Inc. Probe for testing electronic components
JPH0429561Y2 (ja) * 1987-08-18 1992-07-17
US5068602A (en) * 1990-09-07 1991-11-26 Tektronix, Inc. DUT board for a semiconductor device tester having a reconfigurable coaxial interconnect grid and method of using same
US5304921A (en) * 1991-08-07 1994-04-19 Hewlett-Packard Company Enhanced grounding system for short-wire lengthed fixture
US20050062492A1 (en) * 2001-08-03 2005-03-24 Beaman Brian Samuel High density integrated circuit apparatus, test probe and methods of use thereof
US5371654A (en) * 1992-10-19 1994-12-06 International Business Machines Corporation Three dimensional high performance interconnection package
US6246247B1 (en) * 1994-11-15 2001-06-12 Formfactor, Inc. Probe card assembly and kit, and methods of using same
US7073254B2 (en) 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US5597317A (en) * 1995-08-11 1997-01-28 W. L. Gore & Associates, Inc. Surface mating electrical connector
KR0150334B1 (ko) * 1995-08-17 1998-12-01 남재우 수직형니들을 가지는 프로브카드 및 그 제조방법
US5949244A (en) * 1996-01-03 1999-09-07 Miley; David M. Low tolerance probe card and probe ring systems
US5917330A (en) * 1996-01-17 1999-06-29 Miley; David M. Probe ring having electrical components affixed thereto and related apparatus and processes
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
JPH11125646A (ja) * 1997-10-21 1999-05-11 Mitsubishi Electric Corp 垂直針型プローブカード、その製造方法およびその不良プローブ針の交換方法
US6160412A (en) * 1998-11-05 2000-12-12 Wentworth Laboratories, Inc. Impedance-matched interconnection device for connecting a vertical-pin integrated circuit probing device to integrated circuit test equipment
US6177805B1 (en) * 1998-11-24 2001-01-23 International Business Machines Corporation High density test connector for disk drives in a high volume manufacturing environment
US6255602B1 (en) 1999-03-15 2001-07-03 Wentworth Laboratories, Inc. Multiple layer electrical interface
US6351133B1 (en) * 1999-03-31 2002-02-26 Adoamtest Corp. Packaging and interconnection of contact structure
US6812720B1 (en) * 2003-04-17 2004-11-02 Chipmos Technologies (Bermuda) Ltd. Modularized probe card with coaxial transmitters
US6967556B2 (en) * 2003-06-30 2005-11-22 International Business Machines Corporation High power space transformer
US6967557B2 (en) * 2003-08-26 2005-11-22 International Business Machines Corporation Wafer test space transformer
DE102004023987B4 (de) * 2004-05-14 2008-06-19 Feinmetall Gmbh Elektrische Prüfeinrichtung
DE102004027886A1 (de) * 2004-05-28 2005-12-22 Feinmetall Gmbh Prüfeinrichtung zur elektrischen Prüfung eines Prüflings sowie Verfahren zur Herstellung einer Prüfeinrichtung
US7252514B2 (en) * 2004-09-02 2007-08-07 International Business Machines Corporation High density space transformer and method of fabricating same
DE102006054735A1 (de) * 2005-12-05 2007-06-06 Feinmetall Gmbh Elektrische Kontakteinrichtung und elektrische Prüfvorrichtung für die Prüfung eines elektrischen Prüflings
US7425837B2 (en) * 2006-05-18 2008-09-16 Keithley Instruments, Inc. Spatial transformer for RF and low current interconnect
KR100795909B1 (ko) * 2006-12-12 2008-01-21 삼성전자주식회사 반도체 검사 장치의 프로브 카드
US8970238B2 (en) * 2011-06-17 2015-03-03 Electro Scientific Industries, Inc. Probe module with interleaved serpentine test contacts for electronic device testing
JP6246507B2 (ja) * 2012-11-05 2017-12-13 新光電気工業株式会社 プローブカード及びその製造方法
JP6208486B2 (ja) * 2013-07-19 2017-10-04 新光電気工業株式会社 プローブカード及びその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825818A (ja) * 1971-08-10 1973-04-04

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3493858A (en) * 1966-01-14 1970-02-03 Ibm Inflatable probe apparatus for uniformly contacting and testing microcircuits
US3731191A (en) * 1969-12-22 1973-05-01 Ibm Micro-miniature probe assembly
US3806801A (en) * 1972-12-26 1974-04-23 Ibm Probe contactor having buckling beam probes

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4825818A (ja) * 1971-08-10 1973-04-04

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS623385B2 (ja) * 1976-02-06 1987-01-24 Nippon Telegraph & Telephone
JPS5295182A (en) * 1976-02-06 1977-08-10 Nippon Telegr & Teleph Corp <Ntt> Measurement for high frequency characteristics of transistor wafer
JPS5395770U (ja) * 1976-12-30 1978-08-04
JPS5729314Y2 (ja) * 1976-12-30 1982-06-26
JPS5574047U (ja) * 1978-11-13 1980-05-21
JPS5711414Y2 (ja) * 1978-11-13 1982-03-05
JPS57204472A (en) * 1981-06-05 1982-12-15 Maikuro Component Tekunorojii Electric connector to electric device
JPS58120652U (ja) * 1982-02-08 1983-08-17 日本電子材料株式会社 プロ−ブカ−ド
JPS5911444U (ja) * 1982-07-13 1984-01-24 日本電子材料株式会社 プロ−ブカ−ド
JPS5972148A (ja) * 1982-09-14 1984-04-24 アキユテスト・コ−ポレ−シヨン 電子回路ウエ−ハ−検査装置
JPS60116244U (ja) * 1984-01-13 1985-08-06 日本電子材料株式会社 プロ−ブカ−ド
JPS6156981A (ja) * 1984-08-27 1986-03-22 Nec Corp 半導体検査装置
JPS6180067A (ja) * 1984-09-21 1986-04-23 インタ−ナショナル　ビジネス　マシ−ンズ　コ−ポレ−ション テスト・プロ−ブ装置
JP2013250145A (ja) * 2012-05-31 2013-12-12 Tokyo Cathode Laboratory Co Ltd プローブカード

Also Published As

Publication number Publication date
FR2275781A1 (fr) 1976-01-16
DE2525166C2 (de) 1985-01-17
US3911361A (en) 1975-10-07
JPS5932740B2 (ja) 1984-08-10
FR2275781B1 (ja) 1977-04-15
DE2525166A1 (de) 1976-01-15
IT1038694B (it) 1979-11-30

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