JPS51132267A - An epoxy resin composition for sealing semi-conductor elements - Google Patents

An epoxy resin composition for sealing semi-conductor elements

Info

Publication number
JPS51132267A
JPS51132267A JP4649475A JP4649475A JPS51132267A JP S51132267 A JPS51132267 A JP S51132267A JP 4649475 A JP4649475 A JP 4649475A JP 4649475 A JP4649475 A JP 4649475A JP S51132267 A JPS51132267 A JP S51132267A
Authority
JP
Japan
Prior art keywords
resin composition
epoxy resin
conductor elements
sealing semi
sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4649475A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5328359B2 (enrdf_load_stackoverflow
Inventor
Masahiro Kitamura
Yoichi Matsuda
Hiroshi Suzuki
Shunichi Numata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Hitachi Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP4649475A priority Critical patent/JPS51132267A/ja
Publication of JPS51132267A publication Critical patent/JPS51132267A/ja
Publication of JPS5328359B2 publication Critical patent/JPS5328359B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP4649475A 1975-04-18 1975-04-18 An epoxy resin composition for sealing semi-conductor elements Granted JPS51132267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4649475A JPS51132267A (en) 1975-04-18 1975-04-18 An epoxy resin composition for sealing semi-conductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4649475A JPS51132267A (en) 1975-04-18 1975-04-18 An epoxy resin composition for sealing semi-conductor elements

Publications (2)

Publication Number Publication Date
JPS51132267A true JPS51132267A (en) 1976-11-17
JPS5328359B2 JPS5328359B2 (enrdf_load_stackoverflow) 1978-08-14

Family

ID=12748764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4649475A Granted JPS51132267A (en) 1975-04-18 1975-04-18 An epoxy resin composition for sealing semi-conductor elements

Country Status (1)

Country Link
JP (1) JPS51132267A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6325604U (enrdf_load_stackoverflow) * 1986-08-05 1988-02-19
JPS63141347U (enrdf_load_stackoverflow) * 1987-03-09 1988-09-19

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49118797A (enrdf_load_stackoverflow) * 1973-03-19 1974-11-13

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49118797A (enrdf_load_stackoverflow) * 1973-03-19 1974-11-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPS5328359B2 (enrdf_load_stackoverflow) 1978-08-14

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