JPS5328359B2 - - Google Patents

Info

Publication number
JPS5328359B2
JPS5328359B2 JP4649475A JP4649475A JPS5328359B2 JP S5328359 B2 JPS5328359 B2 JP S5328359B2 JP 4649475 A JP4649475 A JP 4649475A JP 4649475 A JP4649475 A JP 4649475A JP S5328359 B2 JPS5328359 B2 JP S5328359B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4649475A
Other languages
Japanese (ja)
Other versions
JPS51132267A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4649475A priority Critical patent/JPS51132267A/ja
Publication of JPS51132267A publication Critical patent/JPS51132267A/ja
Publication of JPS5328359B2 publication Critical patent/JPS5328359B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP4649475A 1975-04-18 1975-04-18 An epoxy resin composition for sealing semi-conductor elements Granted JPS51132267A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4649475A JPS51132267A (en) 1975-04-18 1975-04-18 An epoxy resin composition for sealing semi-conductor elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4649475A JPS51132267A (en) 1975-04-18 1975-04-18 An epoxy resin composition for sealing semi-conductor elements

Publications (2)

Publication Number Publication Date
JPS51132267A JPS51132267A (en) 1976-11-17
JPS5328359B2 true JPS5328359B2 (enrdf_load_stackoverflow) 1978-08-14

Family

ID=12748764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4649475A Granted JPS51132267A (en) 1975-04-18 1975-04-18 An epoxy resin composition for sealing semi-conductor elements

Country Status (1)

Country Link
JP (1) JPS51132267A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6325604U (enrdf_load_stackoverflow) * 1986-08-05 1988-02-19
JPS63141347U (enrdf_load_stackoverflow) * 1987-03-09 1988-09-19

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5967660A (ja) * 1982-10-12 1984-04-17 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いた樹脂封止型半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5121679B2 (enrdf_load_stackoverflow) * 1973-03-19 1976-07-03

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6325604U (enrdf_load_stackoverflow) * 1986-08-05 1988-02-19
JPS63141347U (enrdf_load_stackoverflow) * 1987-03-09 1988-09-19

Also Published As

Publication number Publication date
JPS51132267A (en) 1976-11-17

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