JPS5062437A - - Google Patents
Info
- Publication number
- JPS5062437A JPS5062437A JP49112362A JP11236274A JPS5062437A JP S5062437 A JPS5062437 A JP S5062437A JP 49112362 A JP49112362 A JP 49112362A JP 11236274 A JP11236274 A JP 11236274A JP S5062437 A JPS5062437 A JP S5062437A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/008—Azides
- G03F7/012—Macromolecular azides; Macromolecular additives, e.g. binders
- G03F7/0125—Macromolecular azides; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the macromolecular azides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6529—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/65—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
- H10P14/6516—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
- H10P14/6536—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
- H10P14/6538—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light by exposure to UV light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/66—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
- H10P14/668—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
- H10P14/6681—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
- H10P14/6684—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H10P14/6686—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/69215—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/63—Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
- H10P14/6326—Deposition processes
- H10P14/6342—Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
- H10P14/69—Inorganic materials
- H10P14/692—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
- H10P14/6921—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
- H10P14/6922—Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Silicon Polymers (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB4577173A GB1451623A (en) | 1973-10-01 | 1973-10-01 | Method of prov8ding a patterned layer of silicon-containing oxide on a substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5062437A true JPS5062437A (enExample) | 1975-05-28 |
Family
ID=10438531
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49112362A Pending JPS5062437A (enExample) | 1973-10-01 | 1974-10-01 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US3969543A (enExample) |
| JP (1) | JPS5062437A (enExample) |
| DE (1) | DE2445714A1 (enExample) |
| FR (1) | FR2246890B1 (enExample) |
| GB (1) | GB1451623A (enExample) |
| IT (1) | IT1022419B (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615046A (en) * | 1979-07-04 | 1981-02-13 | Bbc Brown Boveri & Cie | Method of etching silicon substrate* silicon substrate having etching mask and method of manufacturing pressure sensor |
| JPS589323A (ja) * | 1981-07-10 | 1983-01-19 | Nippon Telegr & Teleph Corp <Ntt> | 微細レジストパタンの形成方法 |
| JPS58219734A (ja) * | 1982-06-14 | 1983-12-21 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法およびそれに用いる感光性材料 |
| JPS62129849A (ja) * | 1985-12-02 | 1987-06-12 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジストパタ−ンの安定化方法 |
| JP2013532223A (ja) * | 2010-06-30 | 2013-08-15 | スリーエム イノベイティブ プロパティズ カンパニー | オンデマンド型硬化性ポリシロキサンコーティング組成物 |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3378931D1 (en) * | 1982-03-26 | 1989-02-16 | Hitachi Ltd | Method for forming fine resist patterns |
| USRE32514E (en) * | 1982-06-14 | 1987-10-06 | Eastman Kodak Company | Polymer compositions having a low coefficient of friction |
| US4473676A (en) * | 1982-06-14 | 1984-09-25 | Eastman Kodak Company | Polymer compositions having a low coefficient of friction |
| US4404276A (en) * | 1982-06-14 | 1983-09-13 | Eastman Kodak Company | Polymer compositions containing crosslinked silicone polycarbinol and having a low coefficient of friction |
| DE3334095A1 (de) * | 1983-09-21 | 1985-04-11 | Brown, Boveri & Cie Ag, 6800 Mannheim | Verfahren zum aetzen tiefer graeben in siliziumscheiben mit glatter oberflaeche |
| US4702990A (en) * | 1984-05-14 | 1987-10-27 | Nippon Telegraph And Telephone Corporation | Photosensitive resin composition and process for forming photo-resist pattern using the same |
| US4892617A (en) * | 1984-08-22 | 1990-01-09 | American Telephone & Telegraph Company, At&T Bell Laboratories | Processes involving lithographic materials |
| US4665010A (en) * | 1985-04-29 | 1987-05-12 | International Business Machines Corporation | Method of fabricating photopolymer isolation trenches in the surface of a semiconductor wafer |
| US4732841A (en) * | 1986-03-24 | 1988-03-22 | Fairchild Semiconductor Corporation | Tri-level resist process for fine resolution photolithography |
| US5057396A (en) * | 1988-09-22 | 1991-10-15 | Tosoh Corporation | Photosensitive material having a silicon-containing polymer |
| EP0397130B1 (en) * | 1989-05-11 | 1995-04-19 | Kanegafuchi Kagaku Kogyo Kabushiki Kaisha | Medical device having highly biocompatible surface and method for manufacturing the same |
| US6465054B2 (en) * | 1997-10-21 | 2002-10-15 | Roche Diagnostics Gmbh | Process for coating surfaces |
| TWI245774B (en) * | 2001-03-01 | 2005-12-21 | Shinetsu Chemical Co | Silicon-containing polymer, resist composition and patterning process |
| TW594416B (en) * | 2001-05-08 | 2004-06-21 | Shipley Co Llc | Photoimageable composition |
| JP4557497B2 (ja) * | 2002-03-03 | 2010-10-06 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | シランモノマー及びポリマーを製造する方法及びそれを含むフォトレジスト組成物 |
| JP2004038142A (ja) | 2002-03-03 | 2004-02-05 | Shipley Co Llc | ポリシロキサンを製造する方法及びそれを含むフォトレジスト組成物 |
| AU2003287194A1 (en) * | 2002-10-21 | 2004-05-13 | Shipley Company L.L.C. | Photoresists containing sulfonamide component |
| KR20040044369A (ko) * | 2002-11-20 | 2004-05-28 | 쉬플리 캄파니, 엘.엘.씨. | 다층 포토레지스트 시스템 |
| KR20040044368A (ko) * | 2002-11-20 | 2004-05-28 | 쉬플리 캄파니, 엘.엘.씨. | 다층 포토레지스트 시스템 |
| US20040229159A1 (en) * | 2003-02-23 | 2004-11-18 | Subbareddy Kanagasabapathy | Fluorinated Si-polymers and photoresists comprising same |
| JP5124077B2 (ja) * | 2003-03-03 | 2013-01-23 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | ポリマー、およびそれを含むフォトレジスト |
| US7713753B2 (en) * | 2008-09-04 | 2010-05-11 | Seagate Technology Llc | Dual-level self-assembled patterning method and apparatus fabricated using the method |
| US8840993B2 (en) | 2010-06-30 | 2014-09-23 | 3M Innovative Properties Company | Curable polysiloxane coating composition |
| WO2012003160A1 (en) | 2010-06-30 | 2012-01-05 | 3M Innovative Properties Company | Curable composition comprising dual reactive silane functionality |
| US9006357B2 (en) | 2011-12-29 | 2015-04-14 | 3M Innovative Properties Company | Curable polysiloxane composition |
| JP2015503660A (ja) | 2011-12-29 | 2015-02-02 | スリーエム イノベイティブ プロパティズ カンパニー | 硬化性ポリシロキサンコーティング組成物 |
| CN104080838B (zh) | 2011-12-29 | 2016-08-17 | 3M创新有限公司 | 可按需固化的聚硅氧烷涂料组合物 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3272670A (en) * | 1965-08-27 | 1966-09-13 | Stanford Research Inst | Two-stable, high-resolution electronactuated resists |
| US3726710A (en) * | 1970-09-02 | 1973-04-10 | Union Carbide Corp | Silicon paper release compositions |
| DE2207495A1 (de) * | 1971-02-20 | 1972-08-24 | Dainippon Printing Co Ltd | Flachdruckplatten und Verfahren zu ihrer Herstellung |
| GB1316711A (en) * | 1971-03-15 | 1973-05-16 | Mullard Ltd | Methods of producing films comprising siliceous material |
| DE2302148C2 (de) * | 1972-01-18 | 1983-02-10 | N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven | Verfahren zur Herstellung eines Phosphorsilicatglasschichtmusters |
| GB1409327A (en) * | 1973-01-10 | 1975-10-08 | Dow Corning Ltd | Process for treating surfaces |
| US3847771A (en) * | 1973-03-30 | 1974-11-12 | Scm Corp | Uv and laser curing of pigmented polymerizable binders |
| US3873499A (en) * | 1973-11-29 | 1975-03-25 | Dow Corning | Fast curing mercaptoalkyl vinyl siloxane resins |
-
1973
- 1973-10-01 GB GB4577173A patent/GB1451623A/en not_active Expired
-
1974
- 1974-09-25 DE DE19742445714 patent/DE2445714A1/de not_active Ceased
- 1974-09-26 US US05/509,493 patent/US3969543A/en not_active Expired - Lifetime
- 1974-09-27 IT IT27844/74A patent/IT1022419B/it active
- 1974-10-01 FR FR7433042A patent/FR2246890B1/fr not_active Expired
- 1974-10-01 JP JP49112362A patent/JPS5062437A/ja active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615046A (en) * | 1979-07-04 | 1981-02-13 | Bbc Brown Boveri & Cie | Method of etching silicon substrate* silicon substrate having etching mask and method of manufacturing pressure sensor |
| JPS589323A (ja) * | 1981-07-10 | 1983-01-19 | Nippon Telegr & Teleph Corp <Ntt> | 微細レジストパタンの形成方法 |
| JPS58219734A (ja) * | 1982-06-14 | 1983-12-21 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法およびそれに用いる感光性材料 |
| JPS62129849A (ja) * | 1985-12-02 | 1987-06-12 | Tokyo Ohka Kogyo Co Ltd | ポジ型ホトレジストパタ−ンの安定化方法 |
| JP2013532223A (ja) * | 2010-06-30 | 2013-08-15 | スリーエム イノベイティブ プロパティズ カンパニー | オンデマンド型硬化性ポリシロキサンコーティング組成物 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE2445714A1 (de) | 1975-04-10 |
| FR2246890A1 (enExample) | 1975-05-02 |
| GB1451623A (en) | 1976-10-06 |
| FR2246890B1 (enExample) | 1979-02-16 |
| IT1022419B (it) | 1978-03-20 |
| US3969543A (en) | 1976-07-13 |