FR2246890B1 - - Google Patents

Info

Publication number
FR2246890B1
FR2246890B1 FR7433042A FR7433042A FR2246890B1 FR 2246890 B1 FR2246890 B1 FR 2246890B1 FR 7433042 A FR7433042 A FR 7433042A FR 7433042 A FR7433042 A FR 7433042A FR 2246890 B1 FR2246890 B1 FR 2246890B1
Authority
FR
France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR7433042A
Other languages
French (fr)
Other versions
FR2246890A1 (enExample
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of FR2246890A1 publication Critical patent/FR2246890A1/fr
Application granted granted Critical
Publication of FR2246890B1 publication Critical patent/FR2246890B1/fr
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/008Azides
    • G03F7/012Macromolecular azides; Macromolecular additives, e.g. binders
    • G03F7/0125Macromolecular azides; Macromolecular additives, e.g. binders characterised by the polymeric binder or the macromolecular additives other than the macromolecular azides
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6529Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to a gas or vapour
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/65Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials
    • H10P14/6516Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials
    • H10P14/6536Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light
    • H10P14/6538Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by treatments performed before or after the formation of the materials of treatments performed after formation of the materials by exposure to radiation, e.g. visible light by exposure to UV light
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/66Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials
    • H10P14/668Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials
    • H10P14/6681Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si
    • H10P14/6684Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen
    • H10P14/6686Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the type of materials the materials being characterised by the deposition precursor materials the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/69215Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material being a silicon oxide, e.g. SiO2
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings
    • H10W74/40Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/63Formation of materials, e.g. in the shape of layers or pillars of insulating materials characterised by the formation processes
    • H10P14/6326Deposition processes
    • H10P14/6342Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/69Inorganic materials
    • H10P14/692Inorganic materials composed of oxides, glassy oxides or oxide-based glasses
    • H10P14/6921Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon
    • H10P14/6922Inorganic materials composed of oxides, glassy oxides or oxide-based glasses containing silicon the material containing Si, O and at least one of H, N, C, F or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/114Initiator containing
    • Y10S430/12Nitrogen compound containing

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Silicon Polymers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
FR7433042A 1973-10-01 1974-10-01 Expired FR2246890B1 (enExample)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4577173A GB1451623A (en) 1973-10-01 1973-10-01 Method of prov8ding a patterned layer of silicon-containing oxide on a substrate

Publications (2)

Publication Number Publication Date
FR2246890A1 FR2246890A1 (enExample) 1975-05-02
FR2246890B1 true FR2246890B1 (enExample) 1979-02-16

Family

ID=10438531

Family Applications (1)

Application Number Title Priority Date Filing Date
FR7433042A Expired FR2246890B1 (enExample) 1973-10-01 1974-10-01

Country Status (6)

Country Link
US (1) US3969543A (enExample)
JP (1) JPS5062437A (enExample)
DE (1) DE2445714A1 (enExample)
FR (1) FR2246890B1 (enExample)
GB (1) GB1451623A (enExample)
IT (1) IT1022419B (enExample)

Families Citing this family (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929682A1 (de) * 1979-07-04 1981-01-15 Bbc Brown Boveri & Cie Verfahren zum aetzen von silizium- substraten und substrat zur durchfuehrung des verfahrens
JPS589323A (ja) * 1981-07-10 1983-01-19 Nippon Telegr & Teleph Corp <Ntt> 微細レジストパタンの形成方法
DE3378931D1 (en) * 1982-03-26 1989-02-16 Hitachi Ltd Method for forming fine resist patterns
USRE32514E (en) * 1982-06-14 1987-10-06 Eastman Kodak Company Polymer compositions having a low coefficient of friction
JPS58219734A (ja) * 1982-06-14 1983-12-21 Matsushita Electric Ind Co Ltd 半導体装置の製造方法およびそれに用いる感光性材料
US4473676A (en) * 1982-06-14 1984-09-25 Eastman Kodak Company Polymer compositions having a low coefficient of friction
US4404276A (en) * 1982-06-14 1983-09-13 Eastman Kodak Company Polymer compositions containing crosslinked silicone polycarbinol and having a low coefficient of friction
DE3334095A1 (de) * 1983-09-21 1985-04-11 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum aetzen tiefer graeben in siliziumscheiben mit glatter oberflaeche
US4702990A (en) * 1984-05-14 1987-10-27 Nippon Telegraph And Telephone Corporation Photosensitive resin composition and process for forming photo-resist pattern using the same
US4892617A (en) * 1984-08-22 1990-01-09 American Telephone & Telegraph Company, At&T Bell Laboratories Processes involving lithographic materials
US4665010A (en) * 1985-04-29 1987-05-12 International Business Machines Corporation Method of fabricating photopolymer isolation trenches in the surface of a semiconductor wafer
JP2552648B2 (ja) * 1985-12-02 1996-11-13 東京応化工業 株式会社 ポジ型ホトレジストパタ−ンの安定化方法
US4732841A (en) * 1986-03-24 1988-03-22 Fairchild Semiconductor Corporation Tri-level resist process for fine resolution photolithography
US5057396A (en) * 1988-09-22 1991-10-15 Tosoh Corporation Photosensitive material having a silicon-containing polymer
EP0397130B1 (en) * 1989-05-11 1995-04-19 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Medical device having highly biocompatible surface and method for manufacturing the same
US6465054B2 (en) * 1997-10-21 2002-10-15 Roche Diagnostics Gmbh Process for coating surfaces
TWI245774B (en) * 2001-03-01 2005-12-21 Shinetsu Chemical Co Silicon-containing polymer, resist composition and patterning process
TW594416B (en) * 2001-05-08 2004-06-21 Shipley Co Llc Photoimageable composition
JP4557497B2 (ja) * 2002-03-03 2010-10-06 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. シランモノマー及びポリマーを製造する方法及びそれを含むフォトレジスト組成物
JP2004038142A (ja) 2002-03-03 2004-02-05 Shipley Co Llc ポリシロキサンを製造する方法及びそれを含むフォトレジスト組成物
AU2003287194A1 (en) * 2002-10-21 2004-05-13 Shipley Company L.L.C. Photoresists containing sulfonamide component
KR20040044369A (ko) * 2002-11-20 2004-05-28 쉬플리 캄파니, 엘.엘.씨. 다층 포토레지스트 시스템
KR20040044368A (ko) * 2002-11-20 2004-05-28 쉬플리 캄파니, 엘.엘.씨. 다층 포토레지스트 시스템
US20040229159A1 (en) * 2003-02-23 2004-11-18 Subbareddy Kanagasabapathy Fluorinated Si-polymers and photoresists comprising same
JP5124077B2 (ja) * 2003-03-03 2013-01-23 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. ポリマー、およびそれを含むフォトレジスト
US7713753B2 (en) * 2008-09-04 2010-05-11 Seagate Technology Llc Dual-level self-assembled patterning method and apparatus fabricated using the method
US8840993B2 (en) 2010-06-30 2014-09-23 3M Innovative Properties Company Curable polysiloxane coating composition
WO2012003152A1 (en) * 2010-06-30 2012-01-05 3M Innovative Properties Company Curable-on-demand composition comprising dual reactive silane functionality
WO2012003160A1 (en) 2010-06-30 2012-01-05 3M Innovative Properties Company Curable composition comprising dual reactive silane functionality
US9006357B2 (en) 2011-12-29 2015-04-14 3M Innovative Properties Company Curable polysiloxane composition
JP2015503660A (ja) 2011-12-29 2015-02-02 スリーエム イノベイティブ プロパティズ カンパニー 硬化性ポリシロキサンコーティング組成物
CN104080838B (zh) 2011-12-29 2016-08-17 3M创新有限公司 可按需固化的聚硅氧烷涂料组合物

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3272670A (en) * 1965-08-27 1966-09-13 Stanford Research Inst Two-stable, high-resolution electronactuated resists
US3726710A (en) * 1970-09-02 1973-04-10 Union Carbide Corp Silicon paper release compositions
DE2207495A1 (de) * 1971-02-20 1972-08-24 Dainippon Printing Co Ltd Flachdruckplatten und Verfahren zu ihrer Herstellung
GB1316711A (en) * 1971-03-15 1973-05-16 Mullard Ltd Methods of producing films comprising siliceous material
DE2302148C2 (de) * 1972-01-18 1983-02-10 N.V. Philips' Gloeilampenfabrieken, 5621 Eindhoven Verfahren zur Herstellung eines Phosphorsilicatglasschichtmusters
GB1409327A (en) * 1973-01-10 1975-10-08 Dow Corning Ltd Process for treating surfaces
US3847771A (en) * 1973-03-30 1974-11-12 Scm Corp Uv and laser curing of pigmented polymerizable binders
US3873499A (en) * 1973-11-29 1975-03-25 Dow Corning Fast curing mercaptoalkyl vinyl siloxane resins

Also Published As

Publication number Publication date
DE2445714A1 (de) 1975-04-10
FR2246890A1 (enExample) 1975-05-02
GB1451623A (en) 1976-10-06
JPS5062437A (enExample) 1975-05-28
IT1022419B (it) 1978-03-20
US3969543A (en) 1976-07-13

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Legal Events

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ST Notification of lapse