JPS50137683A - - Google Patents

Info

Publication number
JPS50137683A
JPS50137683A JP50031253A JP3125375A JPS50137683A JP S50137683 A JPS50137683 A JP S50137683A JP 50031253 A JP50031253 A JP 50031253A JP 3125375 A JP3125375 A JP 3125375A JP S50137683 A JPS50137683 A JP S50137683A
Authority
JP
Japan
Prior art keywords
wafer
carrier
minimize
package
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP50031253A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5220311B2 (OSRAM
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS50137683A publication Critical patent/JPS50137683A/ja
Publication of JPS5220311B2 publication Critical patent/JPS5220311B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H10W40/73—
    • H10W70/611—
    • H10W90/401—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H10W72/5363—
    • H10W90/754—
JP50031253A 1974-04-19 1975-03-17 Expired JPS5220311B2 (OSRAM)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/462,462 US3999105A (en) 1974-04-19 1974-04-19 Liquid encapsulated integrated circuit package

Publications (2)

Publication Number Publication Date
JPS50137683A true JPS50137683A (OSRAM) 1975-10-31
JPS5220311B2 JPS5220311B2 (OSRAM) 1977-06-02

Family

ID=23836496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP50031253A Expired JPS5220311B2 (OSRAM) 1974-04-19 1975-03-17

Country Status (7)

Country Link
US (1) US3999105A (OSRAM)
JP (1) JPS5220311B2 (OSRAM)
CA (1) CA1021864A (OSRAM)
DE (1) DE2514123C2 (OSRAM)
FR (1) FR2268358B1 (OSRAM)
GB (1) GB1481112A (OSRAM)
IT (1) IT1031597B (OSRAM)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224958A (ja) * 1986-03-19 1987-10-02 ヒエミ−　ウント　フイルタ−　ゲゼルシヤフト　ミツト　ベシユレンクタ−　ハフツング 相互に積層された主モジユ−ルを有する電子装置

Families Citing this family (106)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767938A (en) * 1972-05-26 1973-10-23 Ibm Zero sense after peak detection circuit
US4126882A (en) * 1976-08-02 1978-11-21 Texas Instruments Incorporated Package for multielement electro-optical devices
DE2806685A1 (de) * 1978-02-16 1979-08-23 Siemens Ag Stapelbauweise fuer halbleiter- speicherbausteine
JPS55156395A (en) * 1979-05-24 1980-12-05 Fujitsu Ltd Method of fabricating hollow multilayer printed board
GB2100064B (en) * 1981-05-29 1984-12-12 Ferranti Ltd Electrical circuit assembly
DE3321321A1 (de) * 1982-06-19 1983-12-22 Ferranti plc, Gatley, Cheadle, Cheshire Elektrische schaltungsanordnung
US4590538A (en) * 1982-11-18 1986-05-20 Cray Research, Inc. Immersion cooled high density electronic assembly
DE3424876A1 (de) * 1984-07-06 1986-02-06 Telefunken Fernseh Und Rundfunk Gmbh, 3000 Hannover Integrierter schaltkreis
US4583005A (en) * 1984-07-23 1986-04-15 Sundstrand Corporation Solid state switch assembly
US4750092A (en) * 1985-11-20 1988-06-07 Kollmorgen Technologies Corporation Interconnection package suitable for electronic devices and methods for producing same
WO1987006092A1 (en) * 1986-03-25 1987-10-08 Dowty Electronic Components Limited Interconnection systems for electrical circuits
US4922381A (en) * 1986-03-25 1990-05-01 Hughes Aircraft Company Stacked circuit cards and guided configurations
US4888663A (en) * 1986-03-25 1989-12-19 Hughes Aircraft Company Cooling system for electronic assembly
US4954875A (en) * 1986-07-17 1990-09-04 Laser Dynamics, Inc. Semiconductor wafer array with electrically conductive compliant material
DE3642723A1 (de) * 1986-12-13 1988-06-23 Grundfos Int Statischer frequenzumrichter, insbesondere frequenzumrichter zur steuerung und/oder regelung von leistungsgroessen eines elektromotors
US4862249A (en) * 1987-04-17 1989-08-29 Xoc Devices, Inc. Packaging system for stacking integrated circuits
US4953005A (en) * 1987-04-17 1990-08-28 Xoc Devices, Inc. Packaging system for stacking integrated circuits
US4899208A (en) * 1987-12-17 1990-02-06 International Business Machines Corporation Power distribution for full wafer package
US5036431A (en) * 1988-03-03 1991-07-30 Ibiden Co., Ltd. Package for surface mounted components
US4847731A (en) * 1988-07-05 1989-07-11 The United States Of America As Represented By The Secretary Of The Navy Liquid cooled high density packaging for high speed circuits
US5724248A (en) * 1989-05-04 1998-03-03 Texas Instruments Incorporated Devices and systems with protective terminal configuration, and methods
US4953060A (en) * 1989-05-05 1990-08-28 Ncr Corporation Stackable integrated circuit chip package with improved heat removal
US5083194A (en) * 1990-01-16 1992-01-21 Cray Research, Inc. Air jet impingement on miniature pin-fin heat sinks for cooling electronic components
US5166775A (en) * 1990-01-16 1992-11-24 Cray Research, Inc. Air manifold for cooling electronic devices
US5057909A (en) * 1990-01-29 1991-10-15 International Business Machines Corporation Electronic device and heat sink assembly
US5169805A (en) * 1990-01-29 1992-12-08 International Business Machines Corporation Method of resiliently mounting an integrated circuit chip to enable conformal heat dissipation
US5053853A (en) * 1990-05-08 1991-10-01 International Business Machines Corporation Modular electronic packaging system
US5130768A (en) * 1990-12-07 1992-07-14 Digital Equipment Corporation Compact, high-density packaging apparatus for high performance semiconductor devices
US5322812A (en) * 1991-03-20 1994-06-21 Crosspoint Solutions, Inc. Improved method of fabricating antifuses in an integrated circuit device and resulting structure
DE4136355A1 (de) * 1991-11-05 1993-05-06 Smt & Hybrid Gmbh, O-8010 Dresden, De Verfahren und anordnung zur dreidimensionalen montage von elektronischen bauteilen und sensoren
WO1993012638A1 (en) * 1991-12-18 1993-06-24 Crosspoint Solutions, Inc. Extended architecture for field programmable gate array
US5230564A (en) * 1992-03-20 1993-07-27 Cray Research, Inc. Temperature monitoring system for air-cooled electric components
USD367915S (en) 1992-10-02 1996-03-12 Flowline Inc. Controller electronics enclosure for liquid handling equipment
US5305184A (en) * 1992-12-16 1994-04-19 Ibm Corporation Method and apparatus for immersion cooling or an electronic board
FR2716769B1 (fr) * 1994-02-28 1996-05-15 Peugeot Dispositif de commande et de contrôle d'un moteur électronique, support utilisable dans un tel dispositif et utilisation de ce support pour la réalisation d'une batterie d'éléments d'accumulateurs électriques.
DE4408356A1 (de) * 1994-03-14 1995-09-21 Ralf Dipl Ing Bierschenk Vorrichtung zur Adaptierung von Schaltkreisen
US5536177A (en) * 1994-03-18 1996-07-16 The Whitaker Corporation Set of connectors for stacked circuit board array
US6124633A (en) * 1994-06-23 2000-09-26 Cubic Memory Vertical interconnect process for silicon segments with thermally conductive epoxy preform
US6486528B1 (en) 1994-06-23 2002-11-26 Vertical Circuits, Inc. Silicon segment programming apparatus and three terminal fuse configuration
US5698895A (en) * 1994-06-23 1997-12-16 Cubic Memory, Inc. Silicon segment programming method and apparatus
US5657206A (en) * 1994-06-23 1997-08-12 Cubic Memory, Inc. Conductive epoxy flip-chip package and method
US6255726B1 (en) 1994-06-23 2001-07-03 Cubic Memory, Inc. Vertical interconnect process for silicon segments with dielectric isolation
US5675180A (en) 1994-06-23 1997-10-07 Cubic Memory, Inc. Vertical interconnect process for silicon segments
US6080596A (en) * 1994-06-23 2000-06-27 Cubic Memory Inc. Method for forming vertical interconnect process for silicon segments with dielectric isolation
US5891761A (en) * 1994-06-23 1999-04-06 Cubic Memory, Inc. Method for forming vertical interconnect process for silicon segments with thermally conductive epoxy preform
US5567984A (en) * 1994-12-08 1996-10-22 International Business Machines Corporation Process for fabricating an electronic circuit package
US5586896A (en) * 1995-01-11 1996-12-24 The Whitaker Corporation Heater ring connector assembly
US5815370A (en) * 1997-05-16 1998-09-29 Allied Signal Inc Fluidic feedback-controlled liquid cooling module
ATE316323T1 (de) 1997-10-27 2006-02-15 Discovery Semiconductors Inc Mikrosatelliten mit integrierten schaltkreisen
RU2133523C1 (ru) * 1997-11-03 1999-07-20 Закрытое акционерное общество "Техно-ТМ" Трехмерный электронный модуль
US6297960B1 (en) * 1998-06-30 2001-10-02 Micron Technology, Inc. Heat sink with alignment and retaining features
AU6757200A (en) * 1999-08-04 2001-03-05 Salvatore T. Brancaleone Interface adapter
US6222264B1 (en) 1999-10-15 2001-04-24 Dell Usa, L.P. Cooling apparatus for an electronic package
JP2001352035A (ja) * 2000-06-07 2001-12-21 Sony Corp 多層半導体装置の組立治具及び多層半導体装置の製造方法
US7068511B1 (en) 2001-12-31 2006-06-27 Richard S. Norman High-density architecture for a microelectronic complex on a planar body
US7279787B1 (en) 2001-12-31 2007-10-09 Richard S. Norman Microelectronic complex having clustered conductive members
US6963685B2 (en) * 2002-07-09 2005-11-08 Daniel Mahgerefteh Power source for a dispersion compensation fiber optic system
US7263291B2 (en) * 2002-07-09 2007-08-28 Azna Llc Wavelength division multiplexing source using multifunctional filters
US7663762B2 (en) * 2002-07-09 2010-02-16 Finisar Corporation High-speed transmission system comprising a coupled multi-cavity optical discriminator
US7054538B2 (en) * 2002-10-04 2006-05-30 Azna Llc Flat dispersion frequency discriminator (FDFD)
US7558488B2 (en) * 2002-11-06 2009-07-07 Finisar Corporation Reach extension by using external Bragg grating for spectral filtering
US7505694B2 (en) * 2002-11-06 2009-03-17 Finisar Corporation Thermal chirp compensation systems for a chirp managed directly modulated laser (CML™) data link
US7536113B2 (en) * 2002-11-06 2009-05-19 Finisar Corporation Chirp managed directly modulated laser with bandwidth limiting optical spectrum reshaper
US7742542B2 (en) * 2002-11-06 2010-06-22 Finisar Corporation Phase correlated quadrature amplitude modulation
US7280721B2 (en) * 2002-11-06 2007-10-09 Azna Llc Multi-ring resonator implementation of optical spectrum reshaper for chirp managed laser technology
US7564889B2 (en) * 2002-11-06 2009-07-21 Finisar Corporation Adiabatically frequency modulated source
US7813648B2 (en) * 2002-12-03 2010-10-12 Finisar Corporation Method and apparatus for compensating for fiber nonlinearity in a transmission system
US7809280B2 (en) * 2002-12-03 2010-10-05 Finisar Corporation Chirp-managed, electroabsorption-modulated laser
US6949817B1 (en) * 2002-12-03 2005-09-27 Applied Micro Circuits Corporation Stackable test apparatus for protecting integrated circuit packages during testing
US7609977B2 (en) * 2002-12-03 2009-10-27 Finisar Corporation Optical transmission using semiconductor optical amplifier (SOA)
US7907648B2 (en) * 2002-12-03 2011-03-15 Finisar Corporation Optical FM source based on intra-cavity phase and amplitude modulation in lasers
US7474859B2 (en) * 2002-12-03 2009-01-06 Finisar Corporation Versatile compact transmitter for generation of advanced modulation formats
US7480464B2 (en) * 2002-12-03 2009-01-20 Finisar Corporation Widely tunable, dispersion tolerant transmitter
US7925172B2 (en) * 2002-12-03 2011-04-12 Finisar Corporation High power, low distortion directly modulated laser transmitter
US7613401B2 (en) * 2002-12-03 2009-11-03 Finisar Corporation Optical FM source based on intra-cavity phase and amplitude modulation in lasers
US7860404B2 (en) * 2002-12-03 2010-12-28 Finisar Corporation Optical FM source based on intra-cavity phase and amplitude modulation in lasers
US7542683B2 (en) 2002-12-03 2009-06-02 Finisar Corporation Chirp Managed Laser (CML) transmitter
US8792531B2 (en) 2003-02-25 2014-07-29 Finisar Corporation Optical beam steering for tunable laser applications
US7630425B2 (en) * 2003-02-25 2009-12-08 Finisar Corporation Optical beam steering for tunable laser applications
US6892646B1 (en) * 2003-07-11 2005-05-17 Raytheon Company Granular matter filled weapon guidance electronics unit
US7475637B2 (en) * 2004-07-09 2009-01-13 Jahangir S. Rastegar Gun fired sensor platforms
US7639955B2 (en) * 2004-09-02 2009-12-29 Finisar Corporation Method and apparatus for transmitting a signal using a chirp managed laser (CML) and an optical spectrum reshaper (OSR) before an optical receiver
US20070012860A1 (en) * 2005-05-05 2007-01-18 Daniel Mahgerefteh Optical source with ultra-low relative intensity noise (RIN)
US7697186B2 (en) * 2006-10-24 2010-04-13 Finisar Corporation Spectral response modification via spatial filtering with optical fiber
WO2008080171A1 (en) 2006-12-22 2008-07-03 Finisar Corporation Optical transmitter having a widely tunable directly modulated laser and periodic optical spectrum reshaping element
US7941057B2 (en) 2006-12-28 2011-05-10 Finisar Corporation Integral phase rule for reducing dispersion errors in an adiabatically chirped amplitude modulated signal
US8131157B2 (en) * 2007-01-22 2012-03-06 Finisar Corporation Method and apparatus for generating signals with increased dispersion tolerance using a directly modulated laser transmitter
US7962044B2 (en) 2007-02-02 2011-06-14 Finisar Corporation Temperature stabilizing packaging for optoelectronic components in a transmitter module
US8143720B2 (en) 2007-02-06 2012-03-27 Rambus Inc. Semiconductor module with micro-buffers
US7991291B2 (en) 2007-02-08 2011-08-02 Finisar Corporation WDM PON based on DML
US8027593B2 (en) 2007-02-08 2011-09-27 Finisar Corporation Slow chirp compensation for enhanced signal bandwidth and transmission performances in directly modulated lasers
US7697847B2 (en) * 2007-04-02 2010-04-13 Finisar Corporation Dispersion compensator for frequency reshaped optical signals
US7991297B2 (en) * 2007-04-06 2011-08-02 Finisar Corporation Chirped laser with passive filter element for differential phase shift keying generation
US8204386B2 (en) * 2007-04-06 2012-06-19 Finisar Corporation Chirped laser with passive filter element for differential phase shift keying generation
US7760777B2 (en) * 2007-04-13 2010-07-20 Finisar Corporation DBR laser with improved thermal tuning efficiency
US7778295B2 (en) * 2007-05-14 2010-08-17 Finisar Corporation DBR laser with improved thermal tuning efficiency
KR20110002020A (ko) 2008-03-12 2011-01-06 하이프레스 인코포레이티드 디지털 ｒｆ 트랜시버 시스템 및 방법
US7869473B2 (en) * 2008-03-21 2011-01-11 Finisar Corporation Directly modulated laser with isolated modulated gain electrode for improved frequency modulation
US8260150B2 (en) * 2008-04-25 2012-09-04 Finisar Corporation Passive wave division multiplexed transmitter having a directly modulated laser array
US8199785B2 (en) 2009-06-30 2012-06-12 Finisar Corporation Thermal chirp compensation in a chirp managed laser
US9921622B2 (en) * 2013-02-01 2018-03-20 Dell Products, L.P. Stand alone immersion tank data center with contained cooling
US10321603B1 (en) 2018-07-23 2019-06-11 TAS Energy, Inc. Electrical power distribution for immersion cooled information systems
US10257960B1 (en) 2018-07-23 2019-04-09 TAS Energy, Inc. Power distribution for immersion-cooled information systems
DE102019213851A1 (de) * 2019-09-11 2021-03-11 Zf Friedrichshafen Ag Leiterplattenanordnung
US11721585B2 (en) * 2021-08-02 2023-08-08 Jack Zezhong Peng Method for fabricating semiconductor memory and the semiconductor memory
CN116944701A (zh) * 2023-09-11 2023-10-27 深圳市德特锐科技有限公司 一种半导体芯片加工用切割装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE764008C (de) * 1938-06-09 1945-01-11 Philips Patentverwaltung Elektrische Entladungsroehre
US2978612A (en) * 1956-07-27 1961-04-04 Illinois Tool Works Modularized radio receiver
GB1087862A (en) * 1963-04-18 1967-10-18 Sealectro Corp Improvements in or relating to electrical contacts
US3316458A (en) * 1965-01-29 1967-04-25 Hughes Aircraft Co Electronic circuit assembly with recessed substrate mounting means
NL6601298A (OSRAM) * 1965-02-12 1966-08-15
US3417814A (en) * 1967-06-26 1968-12-24 Ibm Air cooled multiliquid heat transfer unit
US3487350A (en) * 1967-08-04 1969-12-30 Amp Inc Multiple contact mounting wafer
US3537063A (en) * 1968-06-17 1970-10-27 Ibm Circuit card connector
US3634879A (en) * 1968-07-15 1972-01-11 Amp Inc Pin receptacle and carrier members therefor
US3495131A (en) * 1968-07-16 1970-02-10 Nat Connector Corp Integrated circuit connector assembly
US3529213A (en) * 1969-04-08 1970-09-15 North American Rockwell Extendable package for electronic assemblies
FR2120197A5 (OSRAM) * 1970-08-04 1972-08-18 Lannionnais Electronique
US3741292A (en) * 1971-06-30 1973-06-26 Ibm Liquid encapsulated air cooled module
US3706010A (en) * 1971-08-20 1972-12-12 Singer Co Packaging structure having cooling means for a multiplicity of hermetic modules for integrated circuit chips
DE2160302C3 (de) * 1971-12-04 1975-07-17 Siemens Ag Kühldose zum Einbau in Scheibenzellenstapel
US3774078A (en) * 1972-03-29 1973-11-20 Massachusetts Inst Technology Thermally integrated electronic assembly with tapered heat conductor
US3764856A (en) * 1972-05-17 1973-10-09 Massachusetts Inst Technology Heat transfer in electronic equipment
US3800191A (en) * 1972-10-26 1974-03-26 Borg Warner Expandible pressure mounted semiconductor assembly
US3851221A (en) * 1972-11-30 1974-11-26 P Beaulieu Integrated circuit package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62224958A (ja) * 1986-03-19 1987-10-02 ヒエミ−　ウント　フイルタ−　ゲゼルシヤフト　ミツト　ベシユレンクタ−　ハフツング 相互に積層された主モジユ−ルを有する電子装置

Also Published As

Publication number Publication date
FR2268358B1 (OSRAM) 1977-04-15
FR2268358A1 (OSRAM) 1975-11-14
CA1021864A (en) 1977-11-29
IT1031597B (it) 1979-05-10
DE2514123C2 (de) 1985-01-17
DE2514123A1 (de) 1975-10-30
US3999105A (en) 1976-12-21
JPS5220311B2 (OSRAM) 1977-06-02
GB1481112A (en) 1977-07-27

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