DE3787032D1 - Elektronische module hoher dichte, verfahren und erzeugnis. - Google Patents
Elektronische module hoher dichte, verfahren und erzeugnis.Info
- Publication number
- DE3787032D1 DE3787032D1 DE8888900618T DE3787032T DE3787032D1 DE 3787032 D1 DE3787032 D1 DE 3787032D1 DE 8888900618 T DE8888900618 T DE 8888900618T DE 3787032 T DE3787032 T DE 3787032T DE 3787032 D1 DE3787032 D1 DE 3787032D1
- Authority
- DE
- Germany
- Prior art keywords
- product
- high density
- terminals
- access plane
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Wire Bonding (AREA)
- Semiconductor Memories (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Filters And Equalizers (AREA)
- Networks Using Active Elements (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US1987/002746 WO1989004113A1 (en) | 1987-10-20 | 1987-10-20 | High-density electronic modules, process and product |
Publications (2)
Publication Number | Publication Date |
---|---|
DE3787032D1 true DE3787032D1 (de) | 1993-09-16 |
DE3787032T2 DE3787032T2 (de) | 1994-03-03 |
Family
ID=22202625
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE88900618T Expired - Fee Related DE3787032T2 (de) | 1987-10-20 | 1987-10-20 | Elektronische module hoher dichte, verfahren und erzeugnis. |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0385979B1 (de) |
JP (1) | JPH088332B2 (de) |
AT (1) | ATE93118T1 (de) |
DE (1) | DE3787032T2 (de) |
WO (1) | WO1989004113A1 (de) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0715969B2 (ja) * | 1991-09-30 | 1995-02-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | マルチチツプ集積回路パツケージ及びそのシステム |
JP3338527B2 (ja) * | 1992-10-07 | 2002-10-28 | 富士通株式会社 | 高密度積層形のコネクタ、及び、コネクタの設計方法 |
US5561622A (en) * | 1993-09-13 | 1996-10-01 | International Business Machines Corporation | Integrated memory cube structure |
US5502667A (en) * | 1993-09-13 | 1996-03-26 | International Business Machines Corporation | Integrated multichip memory module structure |
US5648684A (en) * | 1995-07-26 | 1997-07-15 | International Business Machines Corporation | Endcap chip with conductive, monolithic L-connect for multichip stack |
FR2745973B1 (fr) * | 1996-03-08 | 1998-04-03 | Thomson Csf | Memoire de masse et procede de fabrication de memoire de masse |
US5915167A (en) * | 1997-04-04 | 1999-06-22 | Elm Technology Corporation | Three dimensional structure memory |
US6624505B2 (en) | 1998-02-06 | 2003-09-23 | Shellcase, Ltd. | Packaged integrated circuits and methods of producing thereof |
IL123207A0 (en) | 1998-02-06 | 1998-09-24 | Shellcase Ltd | Integrated circuit device |
US7408249B2 (en) | 1998-02-06 | 2008-08-05 | Tessera Technologies Hungary Kft. | Packaged integrated circuits and methods of producing thereof |
US7242082B2 (en) | 2002-02-07 | 2007-07-10 | Irvine Sensors Corp. | Stackable layer containing ball grid array package |
US7033664B2 (en) | 2002-10-22 | 2006-04-25 | Tessera Technologies Hungary Kft | Methods for producing packaged integrated circuit devices and packaged integrated circuit devices produced thereby |
US6972480B2 (en) | 2003-06-16 | 2005-12-06 | Shellcase Ltd. | Methods and apparatus for packaging integrated circuit devices |
KR101078621B1 (ko) | 2003-07-03 | 2011-11-01 | 테쎄라 테크놀로지스 아일랜드 리미티드 | 집적회로 디바이스를 패키징하기 위한 방법 및 장치 |
US7566853B2 (en) | 2005-08-12 | 2009-07-28 | Tessera, Inc. | Image sensor employing a plurality of photodetector arrays and/or rear-illuminated architecture |
US8604605B2 (en) | 2007-01-05 | 2013-12-10 | Invensas Corp. | Microelectronic assembly with multi-layer support structure |
US7714426B1 (en) | 2007-07-07 | 2010-05-11 | Keith Gann | Ball grid array package format layers and structure |
WO2021095083A1 (ja) * | 2019-11-11 | 2021-05-20 | ウルトラメモリ株式会社 | 半導体モジュール、dimmモジュール、及びそれらの製造方法 |
CN117677207A (zh) * | 2022-08-10 | 2024-03-08 | 长鑫存储技术有限公司 | 半导体结构、半导体结构的制造方法和半导体器件 |
WO2024135670A1 (ja) * | 2022-12-20 | 2024-06-27 | 先端システム技術研究組合 | 半導体モジュール |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4630096A (en) * | 1984-05-30 | 1986-12-16 | Motorola, Inc. | High density IC module assembly |
US4617160A (en) * | 1984-11-23 | 1986-10-14 | Irvine Sensors Corporation | Method for fabricating modules comprising uniformly stacked, aligned circuit-carrying layers |
US4706166A (en) * | 1986-04-25 | 1987-11-10 | Irvine Sensors Corporation | High-density electronic modules--process and product |
-
1987
- 1987-10-20 AT AT88900618T patent/ATE93118T1/de not_active IP Right Cessation
- 1987-10-20 JP JP63501172A patent/JPH088332B2/ja not_active Expired - Lifetime
- 1987-10-20 WO PCT/US1987/002746 patent/WO1989004113A1/en active IP Right Grant
- 1987-10-20 DE DE88900618T patent/DE3787032T2/de not_active Expired - Fee Related
- 1987-10-20 EP EP88900618A patent/EP0385979B1/de not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH088332B2 (ja) | 1996-01-29 |
EP0385979B1 (de) | 1993-08-11 |
JPH03501428A (ja) | 1991-03-28 |
WO1989004113A1 (en) | 1989-05-05 |
EP0385979A1 (de) | 1990-09-12 |
EP0385979A4 (en) | 1991-06-12 |
ATE93118T1 (de) | 1993-08-15 |
DE3787032T2 (de) | 1994-03-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |